LED Module Submount Reflectance Segmentation
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Solution Overview
Problem
Existing LED modules face challenges in achieving high light-emitting efficiency while maintaining ease of fabrication and design flexibility, particularly in modularizing light source units for reduced thickness and improved reflectance characteristics.
Innovation Solution
The LED module design incorporates a submount substrate with high reflectance for LED elements, a separate module substrate for other electronic components, and a covering material like phosphor resin, allowing for independent design and manufacturing conditions for each substrate, with a dam member to contain the covering material and enhance reflectance around the LED elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single substrate is used for mounting both LED elements and electronic components, then device complexity is reduced, but manufacturing precision and reflectance characteristics deteriorate
Solution Approach 1:
The patent divides the substrate into two separate substrates: a first substrate dedicated to mounting LED elements with high reflectance characteristics, and a second substrate for mounting electronic components. This segmentation allows each substrate to be optimized independently - the first substrate can be designed specifically for light emission and reflectance without compromise from electronic component requirements, while the second substrate can be optimized for electrical functionality. The two substrates are then coupled together to form the complete LED module.
2Length of stationary object
If COB technology is used to mount LED elements directly on the circuit substrate, then module thickness is reduced, but reflectance characteristics and light-emitting efficiency deteriorate
Solution Approach 1:
The patent separates the LED element mounting function from the electronic component mounting function by using two different substrates. The first substrate is specifically designed for COB mounting of LED elements with optimized reflectance characteristics, while the second substrate handles electronic components. This allows the module to achieve reduced thickness through COB technology while maintaining high light-emitting efficiency through dedicated reflectance optimization on the first substrate.
Solution Approach 2:
The patent applies different properties to different parts of the module by using two substrates with distinct characteristics. The first substrate is optimized locally for light emission with high reflectance properties, while the second substrate is optimized for electrical functionality. This local quality differentiation allows COB mounting to achieve thin profile without compromising the reflectance characteristics needed for high light-emitting efficiency.
3Ease of manufacture
If the same substrate is used for both LED elements and electronic components, then ease of manufacture is improved, but design flexibility and adaptability deteriorate
Solution Approach 1:
The patent divides the module into two independently optimizable substrates while maintaining manufacturing efficiency. The first substrate for LED elements and the second substrate for electronic components can be manufactured and prepared independently with their respective optimal processes, then coupled together. This segmentation provides design flexibility to optimize each substrate for its specific function while the overall manufacturing process remains efficient through standardized coupling procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves high light-emitting efficiency by optimizing reflectance around the LED elements while simplifying the fabrication process and reducing manufacturing costs, as the submount substrate with high reflectance is mounted on an inexpensive module substrate, allowing for distinct design and manufacturing conditions for each component.
Implementation Method 1
the reflectance of a surface of the submount substrate is set higher than the reflectance of a surface of the module substrate
Implementation Method 2
a covering material which is filled into an area inside the dam member so as to cover upper faces of the plurality of LED elements
Data Source
AI summary
Provided is an LED module that can be easily manufactured while maintaining good reflective characteristics even when a plurality of LED elements and other electronic components are packaged on a circuit substrate. This LED module is characterized by having: a sub-mounting substrate for packaging a plurality of LED elements; a module substrate for packaging an electronic component other than the plurality of LED elements, the sub-mounting substrate being mounted on the module substrate; a dam material disposed on the module substrate and surrounding a mounting part of the sub-mounting substrate; and a cover member for covering top faces of the plurality of LED elements, the cover member being filled into an inside region of the dam material; the reflectance of a surface of the sub-mounting substrate being set higher than the reflectance of a surface of the module substrate.