LED Display Module Packaging Without Lamp Beads for Thin Sealing

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Solution Overview

Problem

Existing LED display modules are thick and costly due to the use of LED lamp beads, which include a bracket and a sealant layer, making them unsuitable for applications requiring thinness and low cost.

Innovation Solution

A display module and manufacturing method utilizing a substrate with light-emitting units and a packaging layer that covers each unit, eliminating the need for LED lamp beads by directly using LED chips as the light source, thereby reducing thickness and cost while maintaining air-tightness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If LED lamp beads with brackets and sealant layers are used, then air-tightness is satisfied, but the display module becomes thick and costly

Engineering Contradiction:

Improveair-tightnessVSAvoidthickness of display module

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The patent extracts and removes the bracket structure from the LED lamp bead assembly, directly mounting LED chips onto the substrate. This eliminates the unnecessary structural component that contributed to thickness while maintaining the essential light-emitting function and air-tightness through direct chip mounting and sealant application.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the LED chip directly with the substrate by eliminating the separate bracket component. The LED chip is mounted directly onto the substrate surface, combining what were previously separate elements (chip holder and mounting structure) into a more integrated, thinner configuration that maintains structural integrity and sealing.

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If LED lamp beads with brackets and sealant layers are used, then air-tightness is satisfied, but the manufacturing cost increases

Engineering Contradiction:

Improveair-tightnessVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent removes the bracket component from the assembly, eliminating the need to manufacture and assemble this separate part. This reduction in component count directly lowers manufacturing costs while the essential air-tightness function is maintained through direct chip mounting and sealant application.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent adopts a simpler, more cost-effective mounting approach by directly attaching LED chips to the substrate without expensive bracket structures. This simplifies the bill of materials and reduces manufacturing complexity, achieving air-tightness through essential sealing rather than robust mechanical structures.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Reliability

If LED lamp beads are used as light source, then air-tightness is satisfied, but the overall thickness increases

Engineering Contradiction:

Improveair-tightnessVSAvoidoverall thickness

Core Design Contradiction:

ReliabilityVSLength of moving object

Solution Approach 1:

The patent extracts the bracket structure from the LED lamp bead assembly, removing the component that added unnecessary thickness. By mounting LED chips directly on the substrate, the overall height and thickness of the display module are reduced while air-tightness is maintained through direct sealing of the chip mounting area.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

Instead of using a bracket to hold the LED chip (traditional approach), the patent inverts the mounting method by directly attaching the LED chip to the substrate. This reversal of the mounting hierarchy eliminates the intermediate bracket layer, reducing thickness while maintaining structural support and sealing integrity.

Inventive Principle:

Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution results in a thinner, cost-effective LED display module that satisfies air-tightness requirements and protects the light-emitting units, facilitating lighter and thinner designs.

Implementation Method 1

each of the light-emitting units includes at least one LED chip

Methodology Applied

Scientific EffectLight emission: Light Emitting Diode

Implementation Method 2

the packaging layer is configured to transmit light emitted by the LED chip

Methodology Applied

Scientific EffectLight transmission:

Data Source

PatentUS20240405157A1Display module, LED optical device and manufacturing method therefor

Publication Date: 2024.12.05 SHENZHEN JUFEI OPTOELECTRONICS CO LTD

AI summary

A display module, an LED optical device and a manufacturing method therefor. The display module and the LED optical device each includes a substrate (1), a plurality of light-emitting units (2) arranged on the top surface of the substrate (1), and a packaging layer (3) arranged on the substrate (1) and covering each light-emitting unit (2), where each light-emitting unit (2) includes at least one LED chip, and the packaging layer (3) is configured to transmit light emitted by the LED chip.