LED Module Wiring Through Substrate Holes
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Solution Overview
Problem
Conventional side view type LED modules face challenges in achieving compactness due to the limited space for mounting LED chips and electrodes, as well as the additional space required for wires and electrodes, making it difficult to reduce the substrate size effectively.
Innovation Solution
The proposed LED module features a substrate with through holes and corner grooves, along with a wiring structure that includes die bonding pads, through wirings, and rear surface electrodes, allowing for efficient electrical conduction without covering the bottom surface, thereby reducing the space needed for wiring and achieving compactness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the substrate size is reduced to make the LED module more compact, then the projecting height from the circuit board is reduced, but the space for mounting LED chips and electrodes becomes insufficient
Solution Approach 1:
The patent transitions the wiring structure from a planar arrangement on the substrate surface to a three-dimensional configuration using through-holes that penetrate the substrate. This allows wiring to utilize the vertical dimension, effectively separating wiring space from chip mounting space and enabling compact substrate design without compromising either function.
Solution Approach 2:
The substrate is divided into distinct functional zones: chip mounting areas on the surface and wiring channels through the substrate thickness. This segmentation allows independent optimization of chip placement area and wiring path, resolving the space conflict between these two components.
2Reliability
If additional space is allocated for wires and common electrode connections, then electrical conduction is ensured, but the substrate area required increases
Solution Approach 1:
Wiring is moved from the two-dimensional substrate surface to the third dimension by routing conductors through vertically penetrating holes. This eliminates the need for lateral wiring space on the substrate surface, ensuring reliable electrical conduction while minimizing substrate area occupation.
Solution Approach 2:
The wiring structure is nested within the substrate thickness rather than occupying external lateral space. Through-holes containing wiring are embedded in the substrate body, effectively hiding the wiring infrastructure within the substrate's vertical dimension and freeing up surface area.
Data Source
AI summary
An LED module includes a substrate, one or more LED chips supported by a main surface of the substrate, and wirings. The substrate has one or more through holes penetrating from the main surface to a rear surface. The wirings are formed on the substrate and make electrical conduction with the LED chips. The wirings include pads which are formed on the main surface and make electrical conduction with the LED chips, rear surface electrodes which are formed on the rear surface, and through wirings which make electrical conduction between the pads and the rear surface electrodes and are formed on the inner sides of the through holes.