Multi-chip LED Modules with Reflective Coating for Thermal Management
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Solution Overview
Problem
Multi-chip lighting modules face challenges with non-directional and non-uniform light emission, leading to reduced optical efficiency, and conventional thermal management methods are insufficient for heat dissipation, often requiring additional space-consuming heat sinks.
Innovation Solution
A multi-chip module design featuring a thermally dissipative substrate with an electrically conductive layer and a reflective layer, which includes a lead frame with separate conductive connection parts for improved light emission and heat dissipation without the need for additional heat sinks, utilizing a black aluminum substrate for enhanced thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional thermal management methods are used, then heat dissipation is achieved, but additional space-consuming heat sinks are required
Solution Approach 1:
The patent combines the substrate's structural support function with thermal dissipation function by using a thermally dissipative substrate material (such as aluminum nitride or aluminum oxide ceramics) that integrates heat sinking capabilities directly into the substrate, eliminating the need for separate heat sink components and reducing overall device volume
Solution Approach 2:
The substrate is designed to perform multiple functions simultaneously: providing mechanical support for the LED chips, serving as a platform for mounting and electrical connection, and acting as a heat dissipation pathway through its thermally conductive material properties, thereby eliminating dedicated heat sink components
2Illumination intensity
If multiple light sources are mounted on a substrate, then luminous flux output is increased, but light absorption by substrate and spaces between pads reduces optical efficiency
Solution Approach 1:
The patent applies a reflective coating (such as silver or aluminum) to the substrate surface and/or the spaces between conductive pads to convert the harmful light absorption effect into a beneficial reflection effect, directing emitted light away from the substrate and toward the desired emission direction, thereby improving optical efficiency
Solution Approach 2:
The substrate surface is modified with a reflective coating that changes the optical properties of the surface from absorptive to reflective, specifically targeting the wavelength range of LED emission to maximize light directionality and minimize absorption losses
3Illumination intensity
If conductive and reflective pads are used to improve emission properties, then light emission is enhanced, but light is absorbed by substrate and spaces between pads
Solution Approach 1:
The patent applies a reflective coating to the substrate and/or spaces between conductive pads to convert the harmful light absorption effect into a beneficial reflection effect, directing emitted light away from the substrate and toward the desired emission direction
Solution Approach 2:
The patent applies reflective coatings selectively in specific locations where light absorption occurs (such as substrate areas beneath LEDs and spaces between conductive pads), while maintaining the electrical and thermal functions of the conductive pads, thereby locally improving optical efficiency without compromising electrical performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves increased luminous flux output and effective heat dissipation in a compact, cost-effective package, reducing the risk of premature component failure and eliminating the need for additional heat sinks.
Implementation Method 1
A reflective layer is also included that at least partially covers the conductive layer
Implementation Method 2
The present invention provides systems and apparatuses for multi-chip lighting modules which allow for increased luminous flux output and heat dissipation
Data Source
AI summary
A multi-chip lighting module is disclosed for maximizing luminous flux output and thermal management. In one embodiment, a multi-chip module device comprises a substantially thermally dissipative substrate with a dark insulating layer deposited on a surface of the substrate. A plurality of light emitting devices is also provided. An electrically conductive layer is applied to a surface of the substrate, with the conductive layer comprising a plurality of chip carrier parts each having a surface for carrying at least one of the light emitting devices. Each light emitting device has a first and a second electrical terminal. A reflective layer is also provided that at least partially covers the conductive layer.