LED Package Molding Surface for External Light Glare Control
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Solution Overview
Problem
Existing light emitting diode (LED) devices have complex structures that complicate manufacturing and integration into various devices.
Innovation Solution
A light emitting device package with a simple structure, featuring a printed circuit board with a molding layer that surrounds the light emitting device, includes a light emitting structure, a substrate, and bump electrodes, and has a fine concavo-convex part on its surface to manage external light.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a complex LED structure is used, then light emitting performance is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines multiple LED structures (red, green, and blue LEDs) onto a single substrate to form a complete light emitting device. This merging approach integrates multiple light emitting functions into one package, improving overall performance while managing complexity through unified design and manufacturing processes.
2Reliability
If a complex LED structure is used, then light emitting performance is improved, but ease of manufacture deteriorates
Solution Approach 1:
The substrate serves multiple functions: it supports the light emitting structures, provides electrical connections through bump electrodes, and enables integration of multiple LED types. This multi-functionality reduces the need for separate components and assembly steps, improving ease of manufacture while maintaining performance.
3Ease of manufacture
If a smooth molding layer surface is used, then manufacturing simplicity is improved, but external light management capability deteriorates
Solution Approach 1:
The molding layer incorporates fine concavo-convex parts at its surface, creating local variations in surface topology. These localized structural features specifically address external light management through scattering and reflection, while the overall molding layer structure remains simple and manufacturable.
4Ease of manufacture
If external light is not managed, then manufacturing simplicity is improved, but device reliability deteriorates due to glare
Solution Approach 1:
The fine concavo-convex parts on the molding layer surface convert harmful external light (glare) into beneficial scattered and reflected light. This transforms the potential harm of external light interference into a useful function that protects the device while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The simple structure facilitates easier manufacturing and integration, while the molding layer's fine concavo-convex part effectively manages external light, reducing glare and improving the reliability of the light emitting device package.
Implementation Method 1
The molding layer may partially reflect, scatter, or absorb an external light.
Implementation Method 2
The molding layer may partially reflect, scatter, or absorb an external light.
Implementation Method 3
The molding layer may partially reflect, scatter, or absorb an external light.
Implementation Method 4
the molding layer's fine concavo-convex part effectively manages external light, reducing glare
Data Source
AI summary
A light emitting device including a printed circuit board having a front surface and a rear surface, at least one light emitting source disposed on the front surface to emit light in a direction away from the printed circuit board, and a molding layer surrounding the light emitting source, in which the light emitting source includes a light emitting structure, a substrate disposed on the light emitting structure, and a plurality of bump electrodes disposed between the light emitting structure and the printed circuit board, the molding layer covers an upper surface of the substrate and a fine concavo-convex part is formed on a surface of the molding layer exposed to the outside, and the molding layer has a first thickness to transmit at least a fraction of light emitted from the light emitting source, and includes a filler to change a direction of emitted light.