Light Emitting Device Mounting with Bump Deformation
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Solution Overview
Problem
Existing methods for manufacturing light emitting devices result in significant variance in the orientation of light emitting elements, leading to inconsistencies in light distribution and emission efficiency across devices.
Innovation Solution
A method involving the mounting of light emitting elements on a support base with bumps, followed by plastic deformation using molding dies to form a cover member that uniformly covers the elements, reducing orientation variance and ensuring consistent light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If light emitting elements are mounted on a support base with bumps using conventional methods, then the mounting process is simple and quick, but there is significant variance in the orientation of light emitting elements among devices
Solution Approach 1:
The bump structure is prepared in advance on the support base with predetermined positions and orientations. During mounting, the light emitting elements are placed on these pre-positioned bumps, which automatically guide their orientation. This preliminary preparation of the mounting structure eliminates the need for complex real-time alignment procedures, achieving high orientation precision without significantly increasing process complexity.
Solution Approach 2:
The physical parameters of the bump structure (height, diameter, material properties) are optimized to control the orientation of light emitting elements. By adjusting these parameters, the mounting process achieves consistent orientation across devices. The bump acts as a mechanical constraint that transforms the mounting process from a precision alignment task into a simpler placement operation with inherent orientation control.
2Manufacturing precision
If plastic deformation of bumps is applied to form cover member, then orientation variance is minimized and uniformity is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The cover member formation process is merged with the mounting process. The same molding operation that forms the cover member also applies the plastic deformation to the bumps for orientation control. This consolidation of functions achieves orientation uniformity without requiring separate additional steps, maintaining ease of manufacture while improving precision.
Solution Approach 2:
The molding die serves multiple functions: it forms the cover member, applies plastic deformation to the bumps for orientation control, and provides clamping force to secure the light emitting elements. This multi-functional tool achieves precise orientation control without proportionally increasing process complexity, as the same equipment performs multiple tasks.
3Manufacturing precision
If cover member is injected to cover light emitting element lower surface, then emission characteristics uniformity is improved, but manufacturing time increases
Solution Approach 1:
The mold cavity is designed and prepared in advance with the exact geometry needed for the cover member. The injection process is optimized with pre-heated materials and controlled injection rates. This preliminary preparation enables rapid curing and formation of the cover member, achieving uniform emission characteristics without excessive manufacturing time.
Solution Approach 2:
The injection molding process is designed to be continuous, with the cover member material injected and cured in one uninterrupted operation. The molding die maintains clamping pressure throughout the curing process, ensuring continuous formation of the cover member. This continuous operation achieves uniform emission characteristics while minimizing idle time and maintaining efficient production flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes variance in light emitting device orientation and emission characteristics, enhancing the uniformity of light distribution and reducing thickness variations, thereby improving emission efficiency.
Implementation Method 1
pressing between a lower molding die and an upper molding die to plastically deform the bump
Implementation Method 2
injecting the compound of a cover member into a mold cavity between the lower molding die and the upper molding die and curing the compound to form the cover member
Data Source
AI summary
A method for manufacturing a light emitting device, includes a first step of mounting a light emitting element on a support base with a bump; and a second step of clamping the support base and the light emitting element and pressing between a lower molding die and an upper molding die to plastically deform the bump, and injecting the compound of a cover member into a mold cavity between the lower molding die and the upper molding die and curing the compound to form the cover member that covers at least a lower surface of the light emitting element after the first step.