LED Mounting Package with Cutout Wiring for Narrow Pitch
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Solution Overview
Problem
Existing light-emitting element mounting packages face challenges in mounting LEDs with narrow terminal pitches due to thick wiring portions, which prevent narrowing of gaps between adjacent wiring portions, limiting the density and efficiency of LED placement.
Innovation Solution
The design incorporates a light-emitting element mounting portion with wiring portions arranged to interpose predetermined gaps, featuring cutout portions on the lower sides of side edges that contact an insulating layer, allowing for thinner sections and improved packing density of LEDs, along with a reflective film and plating film for enhanced connection and light reflectance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If wiring portions are made thick to radiate heat quickly, then heat radiation performance is improved, but the gap between adjacent wiring portions cannot be narrowed, limiting LED placement density
Solution Approach 1:
The wiring portion is segmented into two distinct parts: a thick base portion that provides heat radiation, and a thin upper portion that allows narrow gaps. This segmentation resolves the contradiction by distributing different functional requirements to different parts of the same structure.
Solution Approach 2:
Different parts of the wiring portion have different thicknesses - the base portion is thick for heat radiation while the upper portion is thin for space efficiency. This local quality variation allows the wiring to simultaneously satisfy both heat dissipation requirements and space constraints.
2Reliability
If wiring portions are made thick for structural stability and heat radiation, then reliability is improved, but device complexity increases due to the need for cutout portions and multi-layer structure
Solution Approach 1:
The insulating layer and wiring portion are merged into an integrated structure where the insulating layer forms the base and the wiring portion is directly formed on it with cutout portions. This merging reduces the number of separate components while maintaining both structural stability and the ability to achieve narrow gaps.
3Ease of manufacture
If gaps between wiring portions are widened to accommodate thick wiring, then ease of manufacture is improved, but the packing density of LEDs decreases
Solution Approach 1:
The solution moves from a two-dimensional planar thickness variation to a three-dimensional structure with cutout portions that extend vertically. This dimensional change allows the wiring to have both thick sections for manufacturing stability and thin sections for high density, achieving narrow gaps without compromising manufacturability.
Data Source
AI summary
A light-emitting element mounting package includes a light-emitting element mounting portion that includes a plurality of wiring portions arranged interposing a predetermined gap between the wiring portions facing each other, and an insulating layer on which the light-emitting element mounting portion is mounted, wherein an upper surface of the light-emitting element mounting portion is exposed on the insulating layer, wherein cutout portions are formed on lower sides of side edges of the wiring portions and contact the insulating layer.