LED Package Body Fillets for Compact Light Outcoupling
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Solution Overview
Problem
Existing semiconductor device arrangements, such as LEDs, face challenges in miniaturization to produce compact devices with high outcoupling efficiency.
Innovation Solution
A method involving semiconductor chips spaced on an auxiliary carrier, with a package body assembly formed using a molding method, where fillets are created to increase outcoupling efficiency and the package body is designed to be radiation-opaque or reflective, allowing for compact and efficient radiation emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If semiconductor chips are mounted in prefabricated packages, then the devices are easy to manufacture, but the devices cannot be miniaturized to produce compact LEDs
Solution Approach 1:
The package body is segmented into multiple regions: a first region with a first refractive index surrounding the semiconductor chip, and a second region with a second refractive index different from the first. This segmentation allows different functional zones within the package body, enabling compact design while maintaining manufacturing simplicity through modular structure formation.
Solution Approach 2:
Different regions of the package body are assigned different refractive indices to optimize specific functions in different locations. The first region closer to the semiconductor chip has optimized optical properties for light extraction, while the second region provides additional optical management, allowing compact overall design with enhanced local functionality.
2Ease of manufacture
If the package body is made radiation-opaque, then light extraction is simplified, but outcoupling efficiency decreases
Solution Approach 1:
The package body exhibits spatially varying refractive indices with the first region having a different refractive index than the second region. This local quality variation enables optimized light extraction at different depths, maintaining high outcoupling efficiency while allowing the use of radiation-opaque materials that simplify manufacturing.
Solution Approach 2:
The package body functions as a composite optical structure with multiple regions of different refractive indices. This composite approach enables the package body to simultaneously provide mechanical support, light extraction enhancement through refractive index contrast, and radiation opacity for manufacturing simplicity.
3Strength
If the package body directly adjoins the semiconductor chip, then structural support is maximized, but absorption losses increase
Solution Approach 1:
The package body is segmented into a first region directly adjoining the semiconductor chip and a second region extending from the first region. This segmentation creates an optimized optical path that reduces absorption losses while maintaining structural support, as the refractive index contrast between regions enhances light extraction at critical interfaces.
Solution Approach 2:
The first region of the package body acts as an intermediary optical element between the semiconductor chip and the second region. With its optimized refractive index, it serves as a transition zone that reduces total internal reflection and absorption losses while providing the necessary structural support and mechanical stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the production of compact optoelectronic semiconductor devices with enhanced outcoupling efficiency, reduced absorption losses, and improved thermal and electrical accessibility of the semiconductor chips.
Implementation Method 1
The term molding method here covers all production methods in which a molding composition is introduced into a predetermined mold and in particular is subsequently cured.
Data Source
AI summary
The invention relates to a method for producing a plurality of optoelectronic semiconductor components, including the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.