Light Emitting Device Package Bonding Member Fixing Layer
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Solution Overview
Problem
The existing light emitting device packages face issues with reduced heat radiating properties and bonding force between the light emitting device and the heat radiating member due to degradation and discoloration at the contact portion, which affects light extraction efficiency.
Innovation Solution
A light emitting device package design featuring a bonding member fixing layer with through regions, a heat radiating member made of materials like copper-tungsten, copper, or molybdenum, and a reflective material to enhance bonding and heat dissipation, along with a package body composed of HTCC or LTCC materials, and a resin layer for improved light extraction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a bonding process is carried out at high temperature to mount the luminous chip on the connecting electrode, then the bonding strength is improved, but degradation is generated at the contact portion between the heat radiating member and solder, and the body may discolor due to flux contained in the solder
Solution Approach 1:
A protective layer is introduced as an intermediary between the solder and the heat radiating member/body. This protective layer prevents direct contact between the flux in the solder and the body, thereby preventing discoloration and degradation while still allowing the bonding process to proceed at high temperature for strong bonding.
Solution Approach 2:
The protective layer acts as a sacrificial element that can be disposed of or removed after serving its protective function during bonding. It protects the critical body and heat radiating member contact portions from damage during the bonding process without requiring permanent presence.
2Reliability
If the body is made of HTCC material to ensure durability, then the reliability is improved, but the bonding force between the light emitting device and the heat radiating member decreases due to degradation of the contact portion
Solution Approach 1:
The protective layer serves as a mediator that prevents degradation of the contact portion between the heat radiating member and the body. By blocking the harmful effects of flux and high temperature on the contact interface, the bonding force is maintained while the HTCC body provides its durability benefits.
3Reliability
If the body discoloration occurs in the vicinity of the contact portion due to flux contained in the solder, then the reliability is improved through durable HTCC material, but the reflectivity is reduced, thereby deteriorating light extraction efficiency
Solution Approach 1:
The protective layer acts as a barrier between the flux and the body surface, preventing discoloration that would otherwise occur during the bonding process. This maintains the reflectivity of the body and ensures high light extraction efficiency while still using durable HTCC material for the body.
Solution Approach 2:
The protective layer prevents unwanted color changes (discoloration) of the body by blocking the flux from contacting the body surface. This maintains the original reflective properties of the body material, ensuring optimal light extraction efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat radiating properties and bonding between the light emitting device and the heat radiating member, leading to improved light extraction efficiency and durability.
Implementation Method 1
a heat radiating member disposed in the package body
Implementation Method 2
a reflective material to enhance bonding and heat dissipation
Data Source
AI summary
A light emitting device package is disclosed. The light emitting device package includes a package body, a heat radiating member disposed in the package body, a light emitting device disposed on the heat radiating member, a bonding member disposed between the light emitting device and the heat radiating member, and a bonding member fixing layer disposed around the bonding member, wherein the bonding member fixing layer has at least one through region.