LED Package Bonding Pad Relocation for Light Efficiency
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Solution Overview
Problem
In semiconductor package structures using flip chip bonding, the positioning of bonding pads near the light-emitting surface of LED chips leads to reduced light emitting efficiency due to absorption of emitted light by bonding wires.
Innovation Solution
A semiconductor package structure with an insulating substrate, a patterned conductive layer, and an LED chip, where the bonding pad is positioned at a distance from the LED chip's light-emitting surface, minimizing light absorption by the conductive connection parts, and optionally using a transparent substrate and reflective layers to enhance light extraction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the bonding pad is positioned near the light-emitting surface of the LED chip, then the electrical connection is simplified, but the light emitting efficiency is reduced due to light absorption by bonding wires
Solution Approach 1:
The bonding pad is extracted from the element configuration region and relocated to the element bonding region, separating the electrical connection function from the light-emitting area. This extraction allows the bonding wire to be positioned away from the light path, eliminating light absorption while maintaining electrical connectivity.
Solution Approach 2:
The bonding pad position is changed from a two-dimensional placement near the chip center to a boundary position in the element bonding region. This dimensional repositioning on the substrate surface enables spatial separation between the bonding wire and the light-emitting surface, resolving the contradiction between connection simplicity and light efficiency.
2Loss of energy
If the bonding pad is relocated to the element bonding region, then light absorption by bonding wires is reduced, but the distance between bonding pad and LED chip increases
Solution Approach 1:
The substrate is divided into distinct functional regions: the element configuration region for light emission and the element bonding region for electrical connection. By assigning the bonding pad to the element bonding region, the patent creates localized functional zones that optimize both light emission quality and electrical connection quality independently.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances light emitting efficiency by reducing the absorption of light by conductive connection parts and optimizing the placement of bonding pads to areas of lower light intensity, thereby improving the overall performance of the semiconductor package structure.
Implementation Method 1
the LED chip further includes a reflective layer, configured between the semiconductor layer and the contacts
Implementation Method 2
The insulating substrate is a transparent insulating substrate
Data Source
AI summary
A semiconductor package structure includes an insulating substrate, a patterned conductive layer, a light emitting diode (LED) chip and a conductive connection part. The insulating substrate has an upper surface divided into an element configuration region and an element bonding region. The patterned conductive layer includes plural circuits located in the element configuration region and at least one bonding pad located in the element bonding region. The LED chip is flip chip bonded on the patterned conductive layer and electrically connected to the circuits. The conductive connection part has a first end point electrically connected to the bonding pad and a second end point electrically connected to an external circuit. The bonding pad and a corner of the LED chip are disposed correspondingly. A horizontal distance between an apex of the corner and the first end point of the conductive connection part is greater than or equal to 30 micrometers.