LED Package Cavity Structure for Light Extraction and Heat Dissipation
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Solution Overview
Problem
UV light-emitting semiconductor devices have low light extraction efficiency and poor heat radiation characteristics, leading to ineffective heat dissipation.
Innovation Solution
A semiconductor device package design featuring a conductive body with a cavity and protrusions, an insulating member, and a light-transmissive member, where the conductive body is made of aluminum for improved thermal conductivity and light reflection, and the insulating member is strategically placed to prevent burrs during the package cutting process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional LED package structure is used, then the device can be manufactured with standard processes, but the light extraction efficiency remains low and heat radiation characteristics are poor
Solution Approach 1:
The package body is divided into multiple sections with different functions: a first section with a reflective inner wall for light extraction enhancement, and a second section with a heat dissipation structure. This segmentation allows each section to optimize its specific function while maintaining overall manufacturability through standardized processes.
Solution Approach 2:
Different regions of the package body are assigned different material properties and structural characteristics. The first section has a reflective coating for light extraction, while the second section has enhanced thermal conductivity for heat dissipation. This local differentiation resolves the contradiction by allowing each region to specialize in its primary function.
2Temperature
If the package structure is optimized for heat dissipation, then heat radiation characteristics improve, but the manufacturing complexity increases
Solution Approach 1:
The heat dissipation structure is merged with the existing package body rather than being added as a separate component. The second section of the package body integrates both structural support and heat dissipation functions, reducing the number of discrete parts while achieving improved thermal management.
Solution Approach 2:
The package body is designed to serve multiple functions simultaneously: light extraction enhancement through the reflective first section, heat dissipation through the second section, and mechanical support. This multi-functionality reduces overall device complexity by eliminating the need for separate components for each function.
3Illumination intensity
If the package structure is optimized for light extraction, then light extraction efficiency improves, but heat dissipation capability deteriorates
Solution Approach 1:
The package body is segmented into a first section optimized for light extraction with reflective inner walls, and a second section optimized for heat dissipation with enhanced thermal conductivity. This spatial segmentation allows both functions to coexist without compromising each other's performance.
Solution Approach 2:
The package body employs an asymmetric structure where the first section has a reflective coating geometry optimized for light extraction, while the second section has a different geometry optimized for heat dissipation. This asymmetric design allows each section to specialize in its primary function without being constrained by symmetric design requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances light extraction efficiency and heat radiation characteristics, while preventing burr formation during the cutting process, thus improving the overall performance and manufacturing efficiency of the semiconductor device package.
Implementation Method 1
the conductive body is made of aluminum for improved thermal conductivity and light reflection
Implementation Method 2
the conductive body is made of aluminum for improved thermal conductivity and light reflection
Data Source
Figure 1~2
Figure 3~4
Figure 5~6a
AI summary
A semiconductor device package includes a resin unit (410) having a first through hole (411) and a second through hole (412), a conductive body disposed on the resin unit (410) and having a cavity (11) that is concave in a direction from a top surface of the conductive body toward an outer bottom surface (12) thereof, and a light-emitting device disposed in the cavity (11), wherein the conductive body includes a first protrusion (12a-1) and a second protrusion (12b-1), which protrude in the direction toward the outer bottom surface (12) of the conductive body, and the first protrusion (12a-1) is disposed inside the first through hole (411), the second protrusion (12b-1) is disposed inside the second through hole (412), and a top surface of the resin unit (410) is in contact with a bottom surface of grooves (14a, 14b, 19a, 19b) that are formed in the conductive body to surround the outer bottom surface (12) of the conductive body.