LED Display Package Structure for High-Density Chip Mounting
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Solution Overview
Problem
Light emitting diodes (LEDs) with excessively large luminous areas suffer from low current density, leading to deterioration in luminous efficacy, while those with small luminous areas face challenges in mounting and replacement due to their small size.
Innovation Solution
The use of light emitting diode chips with high current density, achieved through reduction in luminous area, and the implementation of large light emitting diode packages compared to the chips, along with electrode-enlarging portions to facilitate efficient transfer and mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the luminous area of light emitting diodes is reduced to increase current density, then luminous efficacy is improved, but mounting and replacement become difficult due to small size
Solution Approach 1:
The invention divides the light emitting diode system into two distinct components: a small light emitting diode chip (0.1-1mm²) for high current density and luminous efficacy, and a large light emitting diode package (1-10mm²) that serves as the mounting unit. This segmentation allows the chip to optimize electrical performance while the package provides ease of handling and replacement.
Solution Approach 2:
The light emitting diode package acts as an intermediary between the small light emitting diode chip and the substrate. The package includes a mounting substrate with electrode enlarging portions that facilitate easy mounting and replacement operations, while transferring the electrical connection function to the smaller chip.
2Loss of energy
If light emitting diodes are used with small luminous area, then current density increases, but the number of mounting operations increases due to small size
Solution Approach 1:
The invention segments the light emitting diode into a small chip (0.1-1mm²) for high current density and a large package (1-10mm²) for efficient mounting. The package serves as a carrier that consolidates multiple small chips or a single chip with its electrical connections, reducing the number of individual mounting operations required.
Solution Approach 2:
The invention merges the light emitting diode chip with its electrical connection structure and packaging into a single light emitting diode package unit. This combining allows the package to be mounted as one component rather than requiring separate operations for the chip and its electrical connections, thereby improving productivity.
3Reliability
If light emitting diode chips are transferred to substrate electrodes, then electrical connection is established, but transfer failures occur due to size mismatch
Solution Approach 1:
The invention introduces electrode enlarging portions on the mounting substrate as intermediaries between the light emitting diode chip electrodes and the substrate electrodes. These enlarging portions provide a larger contact area that tolerates positioning variations, reducing transfer failures while maintaining reliable electrical connection.
Solution Approach 2:
The invention changes the geometric parameters of the electrical connection interface by creating electrode enlarging portions. The enlarged electrode areas on the mounting substrate provide a larger target area for alignment, reducing the precision requirements for transfer operations while ensuring reliable electrical contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high current density in LEDs despite reduced current supply, improves manufacturing yield and replacement efficiency, and minimizes transfer failures by ensuring precise contact with substrate electrodes.
Implementation Method 1
A light emitting diode refers to an inorganic semiconductor device that emits light through recombination of electrons and holes
Implementation Method 2
emits light through recombination of electrons and holes
Data Source
AI summary
A display apparatus and a method of manufacturing the same are disclosed. The display apparatus includes at least one light emitting diode chip, a conductive portion disposed under the light emitting diode chip and coupled to the light emitting diode chip, and an insulating material surrounding the conductive portion. The conductive portion includes a first conductive portion and a second conductive portion, and the insulating material is formed to expose at least a portion of the upper surfaces of the first conductive portion and the second conductive portion.