LED Package With Convex Mounting Part To Reduce Light Blockage

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Solution Overview

Problem

Conventional LED packages experience reduced light emitting efficiency and brightness due to light emitted from the side surfaces of LED chips being blocked by adjacent chips, leading to significant light loss.

Innovation Solution

The LED package design features a mounting part with a non-planar, upwardly convex cross-section, allowing adjacent LED chips to have opposing side surfaces facing different directions, preventing light blockage and enhancing light extraction efficiency. This design includes a reflector cup and a resin encapsulant with phosphors for producing white light, and elongated LED chips with a high length-to-width ratio for improved light emission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If multiple LED chips are mounted on a planar surface, then the brightness and color variety are improved, but the light emitting efficiency is degraded due to light blockage

Engineering Contradiction:
ImprovebrightnessVSAvoidlight emitting efficiency
Core Design Contradiction:
Illumination intensityVSLoss of energy

Solution Approach 1:

The mounting part is designed with an asymmetric non-planar top portion featuring upwardly convexed cross-section, causing adjacent LED chips to have opposing side surfaces facing different directions. This asymmetric arrangement prevents light blockage between chips while maintaining multiple chip configuration for enhanced brightness and color output.

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The invention transitions from a two-dimensional planar mounting surface to a three-dimensional non-planar surface with upward convexity. This dimensional change allows LED chips to be positioned at different heights and angles, enabling side-emitted light to escape without being blocked by adjacent chips, thereby improving light extraction efficiency.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If LED chips are mounted in close proximity, then the device size is reduced, but light blockage occurs between adjacent chips

Engineering Contradiction:
Improvepackage sizeVSAvoidlight loss
Core Design Contradiction:
Area of stationary objectVSLoss of energy

Solution Approach 1:

By utilizing the third dimension (vertical height) through the non-planar mounting surface with upward convexity, the invention allows multiple LED chips to be positioned in close horizontal proximity while maintaining angular separation. This enables compact package size without sacrificing light extraction efficiency, as chips face different directions to prevent mutual light blockage.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly increases light emitting efficiency and brightness by minimizing light loss from side-emitted light, allowing for higher brightness and efficiency in LED packages, especially when using multiple colored LEDs or phosphor-converted white light.

Implementation Method 1

the body has a reflector cup formed in an upper part thereof

Methodology Applied
Scientific EffectReflection: Reflection

Implementation Method 2

the resin encapsulant has a yellow phosphor (or red or green phosphor) dispersed therein

Methodology Applied
Scientific EffectPhosphorescence: Phosphorescence

Data Source

PatentUS8546834B2LED package
Publication Date: 2013.10.01 SAMSUNG ELECTRONICS CO LTD
  • US8546834B2 patent drawing
  • US8546834B2 patent drawing
  • US8546834B2 patent drawing

AI summary

An LED package improved in efficiency and brightness. In the package, a body has a mounting part thereon. A plurality of light emitting diode chips are mounted on the mounting part. The mounting part has a cross-section upwardly convexed with a non-planar top portion so that at least two adjacent ones of the light emitting diode chips have opposing side surfaces facing a different direction from each other.