Light Emitting Device Package with Convex Support Recesses

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Solution Overview

Problem

Thin light emitting devices face challenges in maintaining stability during manufacturing and mounting due to flash formation and increased risk of defects like tilting and the Manhattan phenomenon, which affect production efficiency and product quality.

Innovation Solution

The light emitting device features cut-outs for outer lead electrodes, side face convex components with grooves, and a center convex component, allowing for stable support and reduced thickness while minimizing mounting defects by ensuring proper alignment and stress distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If support leads are provided to the top face and side faces of the package, then the package can be stably supported during manufacturing, but flash forms when the support leads are removed, increasing the external size of the package

Engineering Contradiction:
Improvestability of package during manufacturingVSAvoidexternal size of package
Core Design Contradiction:
Stability of the object's compositionVSLength of stationary object

Solution Approach 1:

The invention extracts the support function from traditional support leads and relocates it to recesses formed directly in the package body. The support leads are completely removed after molding, eliminating flash formation while maintaining stable support during manufacturing through the recess structures that hold the lead frame in place.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The recesses in the package body serve as intermediary structures that provide support during manufacturing without requiring permanent support leads. These recesses act as temporary support mechanisms during the molding process, allowing stable support lead removal without flash.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Length of stationary object

If the package thickness is reduced to achieve a thinner light emitting device, then the device becomes more compact, but the support leads become finer and more prone to twisting and package tilting

Engineering Contradiction:
Improvethickness of packageVSAvoidstability of support leads
Core Design Contradiction:
Length of stationary objectVSReliability

Solution Approach 1:

The invention removes support leads entirely and replaces them with recesses formed in the package body. This eliminates the reliability issues of fine support leads twisting and causing package tilting, while maintaining package stability through the recess structures that securely hold the lead frame during manufacturing.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

Instead of relying on the dimensional stability of thin support leads, the invention uses recesses that provide support through a different structural dimension - the recesses create mechanical interlocking with the lead frame, providing stability without requiring thick support leads.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Stability of the object's composition

If support leads are embedded in the package side faces, then the package can be supported, but removing these leads causes flash that requires additional cutting steps, reducing production efficiency

Engineering Contradiction:
Improvesupport function during manufacturingVSAvoidproduction efficiency
Core Design Contradiction:
Stability of the object's compositionVSProductivity

Solution Approach 1:

The invention extracts the support function from removable support leads and embeds it directly into the package structure through recesses. This eliminates the need to remove support leads after molding, eliminating flash formation and the associated cutting steps, thereby improving production efficiency while maintaining support functionality during manufacturing.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The recesses are formed in the package body before the support leads are removed. This preliminary structuring of the package with built-in support recesses allows the support function to be established in advance, eliminating the need for subsequent lead removal operations that cause flash and reduce productivity.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentEP2244310B1Light emitting device
Publication Date: 2016.06.29 NICHIA CORP
  • EP2244310B1 patent drawingFigure 1A~1C
  • EP2244310B1 patent drawingFigure 2A~2C
  • EP2244310B1 patent drawingFigure 2D~2G

AI summary

A light emitting device comprises; a package equipped on a front face with a window for installing a light emitting element, and outer lead electrodes that protrude from a bottom face of the package, the package having, on the bottom face, two side face convex components provided on the side faces side and a center convex component provided at a center, the outer lead electrodes being housed in a concave components defined by the side face convex components and the center convex component, the side face convex component having groove provided on the side face.