Light Emitting Device Package Interface Coupling Layer

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Solution Overview

Problem

Light emitting device packages face reliability issues under high-temperature, high-moisture conditions due to weak adhesion between the lens molding part and the electrode layer, leading to moisture penetration and thermal stress, which deteriorates sealing quality and reduces light efficiency.

Innovation Solution

The introduction of an interface coupling layer that contacts the lens and is disposed on the electrode layer, enhancing the coupling force between the lens and the reflective layer, and providing insulation to prevent moisture penetration and thermal stress, thereby improving structural stability and light efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If a resin layer including phosphor is disposed on the light emitting device chip with a molding part having a lens shape, then light efficiency is improved, but adhesion between the lens molding part and the electrode layer becomes weak leading to moisture penetration

Engineering Contradiction:
Improvelight efficiencyVSAvoidadhesion strength
Core Design Contradiction:
Illumination intensityVSReliability

Solution Approach 1:

An interface coupling layer is introduced between the lens molding part and the electrode layer to serve as an intermediary that enhances adhesion. This coupling layer prevents direct contact between the resin layer and electrode layer, eliminating the adhesion weakness while maintaining the optical functionality of the lens structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The package structure employs composite materials by combining the resin layer (including phosphor) with a separately introduced interface coupling layer. This composite structure leverages the optical properties of the resin layer while the coupling layer provides enhanced mechanical adhesion to the electrode layer.

Inventive Principle:
Principle #40Composite materials

2Stability of the object's composition

If the lens molding part has an elastic modulus greater than that of the electrode layer, then structural stability is improved, but thermal stress occurs causing delamination when moisture is introduced

Engineering Contradiction:
Improvestructural stabilityVSAvoidresistance to thermal stress
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

The interface coupling layer acts as a buffer between the high elastic modulus lens molding part and the electrode layer, mediating the thermal stress that arises from elastic modulus mismatch. This intermediary layer prevents direct stress transmission that would cause delamination while maintaining structural stability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The interface coupling layer is introduced in advance to cushion against thermal stress before it can cause damage. This preventive measure prepares the structure to withstand thermal expansion and contraction differences between materials with different elastic moduli, preventing delamination before moisture penetration occurs.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Device complexity

If the adhesion between the lens molding part and the electrode layer is weak, then manufacturing complexity is reduced, but sealing quality deteriorates allowing moisture to penetrate to metal layers

Engineering Contradiction:
Improvestructure complexityVSAvoidmoisture penetration
Core Design Contradiction:
Device complexityVSObject-affected harmful factors

Solution Approach 1:

The interface coupling layer serves as a mediating element that improves sealing quality without significantly increasing manufacturing complexity. It creates a reliable barrier against moisture penetration while maintaining a relatively simple layered structure that can be integrated into existing manufacturing processes.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution significantly enhances the reliability and light efficiency of light emitting device packages by preventing moisture penetration and delamination, ensuring improved sealing quality and uniform color temperature.

Implementation Method 1

an interface coupling layer at least partially contacting the lens, the interface coupling layer being disposed on one surface of the electrode layer

Methodology Applied
Scientific EffectAdhesion: Adhesive

Implementation Method 2

a reflective layer on the electrode layer

Methodology Applied
Scientific EffectReflection: Reflection

Data Source

PatentUS9112126B2Light emitting device package, lighting device including the same, and image display device
Publication Date: 2015.08.18 SUZHOU LEKIN SEMICON CO LTD
  • US9112126B2 patent drawing
  • US9112126B2 patent drawing
  • US9112126B2 patent drawing

AI summary

Provided are a light emitting device package, a lighting device, and an image display device. The light emitting device package comprises an electrode layer comprising first and second electrode layers spaced from each other, a recess part in a portion of the first electrode layer, a light emitting device on the recess part of the first electrode layer, a reflective layer on the electrode layer, a resin layer on the light emitting device of the recess part of the first electrode layer, a lens on the resin layer and the reflective layer, an interface coupling layer at least partially contacting the lens, the interface coupling layer being disposed on one surface of the electrode layer, and an insulation layer pattern on the other surface of the electrode layer.