LED Package with Optically Permissive Cover Substrate
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Solution Overview
Problem
Conventional LED devices face high manufacturing costs and thermal resistivity issues due to the use of carrier substrates, which complicate packaging and hinder heat dissipation.
Innovation Solution
The implementation of a light emitting diode (LED) device with an optically permissive cover substrate and layers, including a metallization layer and optically definable materials, to enhance mechanical, electrical, thermal, and optical characteristics, eliminating the need for a carrier substrate and improving heat removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional carrier substrates (silicon or ceramic) are used to support and package LEDs, then mechanical support and electrical connection are provided, but manufacturing cost increases and thermal resistivity increases
Solution Approach 1:
The patent removes the conventional carrier substrate from the LED packaging structure. The LED chip is mounted directly on the lead frame without requiring a separate silicon or ceramic carrier substrate, thereby eliminating the additional cost and thermal resistance introduced by the carrier substrate while maintaining mechanical support through the lead frame structure
Solution Approach 2:
The lead frame is designed to perform multiple functions simultaneously: it provides mechanical support for the LED chip, serves as the electrical connection path, and acts as the heat dissipation structure. This multi-functional design eliminates the need for separate carrier substrates that would otherwise be required for these functions
2Strength
If conventional carrier substrates are used to support LEDs, then mechanical support is provided, but thermal resistivity increases and heat removal is adversely affected
Solution Approach 1:
The patent removes the carrier substrate that acts as a thermal barrier between the LED chip and the heat sink. By mounting the LED chip directly on the lead frame which is in direct thermal contact with the heat dissipation structure, the thermal resistance is minimized while mechanical support is maintained through the lead frame's structural design
Solution Approach 2:
The patent divides the heat dissipation path into direct segments: LED chip → lead frame → heat dissipation structure. This segmented approach eliminates intermediate thermal barriers (carrier substrates) and creates direct thermal conduction paths, improving heat removal efficiency while the lead frame provides the necessary mechanical support
3Ease of manufacture
If conventional packaging techniques are used, then LEDs can be mounted and singulated, but packaging complexity and manufacturing steps increase
Solution Approach 1:
The patent combines multiple packaging functions into a single integrated lead frame structure that provides mechanical support, electrical connection, and heat dissipation simultaneously. The LED chip is mounted directly on the lead frame in a simplified process that eliminates the need for separate carrier substrate attachment, wire bonding, and encapsulation steps required in conventional packaging
Solution Approach 2:
Instead of mounting LEDs on a carrier substrate and then attaching the lead frame (conventional approach), the patent inverts the sequence by mounting LEDs directly on the lead frame structure itself. This inversion simplifies the packaging process and reduces the number of manufacturing steps while maintaining all necessary functions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing complexities and costs while enhancing thermal management and optical performance, resulting in more efficient and cost-effective LED devices.
Implementation Method 1
an optically definable material proximal to or within said optically permissive layer that affects an optical characteristic of emitted light passing there through
Implementation Method 2
a metallization layer over at least a portion of said first surface... provide electrical contact with said first doped layer
Implementation Method 3
A light emitting diode (LED) is a semiconductor device that is configured to receive electrical power or stimulation and to output electromagnetic radiation, commonly in the visible range of the spectrum (light)
Data Source
AI summary
A light emitting diode (LED) device and packaging for same is disclosed. In some aspects, the LED is manufactured using a vertical configuration including a plurality of layers. Certain layers act to promote mechanical, electrical, thermal, or optical characteristics of the device. The device avoids design problems, including manufacturing complexities, costs and heat dissipation problems found in conventional LED devices. Some embodiments include a plurality of optically permissive layers, including an optically permissive cover substrate or wafer stacked over a semiconductor LED and positioned using one or more alignment markers.