Light-Emitting Device Package With Electrically Isolated Electrode Pairs
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Solution Overview
Problem
Conventional light-emitting devices with lead frames connected by reinforcing pieces face issues of short circuits and require singulation for each electrode pair, limiting mounting density due to potential breakage from adjacent device displacement during soldering.
Innovation Solution
The lead frame is designed with electrode pairs connected in series via reinforcing pieces to form a circuit, reducing the need for individual singulation and allowing for higher mounting density without short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If adjacent electrode pairs are coupled together via reinforcing pieces to reduce lead frame deformation, then the lead frame structural stability is improved, but the risk of short circuits between adjacent packages increases and singulation complexity increases
Solution Approach 1:
The lead frame is divided into isolated electrode pairs that are not electrically connected to adjacent pairs. Each electrode pair functions as an independent electrical unit, eliminating the risk of short circuits between adjacent packages while maintaining structural stability through the reinforcing pieces that couple only for mechanical support without electrical connection.
2Stability of the object's composition
If reinforcing pieces are used to couple adjacent electrode pairs, then lead frame deformation is reduced, but the number of manufacturing steps increases due to required singulation
Solution Approach 1:
The lead frame design with electrically isolated electrode pairs allows for simplified singulation processes. Since adjacent electrode pairs are not electrically connected, the singulation can be performed more efficiently without complex isolation steps, improving manufacturing productivity while the reinforcing pieces continue to provide deformation resistance.
3Reliability
If adjacent light-emitting devices are mounted with spacing to prevent contact, then device reliability is improved, but the mounting density decreases
Solution Approach 1:
By segmenting the lead frame into electrically isolated electrode pairs, adjacent light-emitting devices can be mounted closer together without risk of electrical short circuits through the lead frame. The reinforcing pieces provide mechanical coupling without electrical connection, allowing higher mounting density while maintaining reliability through electrical isolation.
Data Source
AI summary
A package includes a plurality of electrode pairs, each electrode pair including a first electrode on one side and a second electrode on another side in a plan view. The first electrode is electrically connected to the second electrode included in an electrode pair adjacent to a first or second lateral side of the one electrode pair, and is not electrically connected to the first electrode included in the electrode pair adjacent to the first or second side of the one electrode pair. The second electrode is electrically connected to the first electrode included in an electrode pair adjacent to a lower side of the one electrode pair, and is not electrically connected to the second electrode included in the electrode pair adjacent to the first or second lateral side of the one electrode pair.