LED Package Lead Frame Enlarged Regions for Wire Bonding
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Solution Overview
Problem
Conventional light emitting diode packages face limitations in wire bonding region size, which restricts the positioning of Zener diodes and affects luminous efficacy and heat dissipation, making it difficult to apply techniques that require larger hole cups due to insufficient wire bonding regions.
Innovation Solution
The design includes enlarged regions on lead frames between hole cups and gaps, allowing for sufficient wire bonding areas without increasing the distance between light emitting diode chips, and enabling larger hole cups that improve luminous efficacy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the wire bonding region size is increased to accommodate Zener diode positioning and improve luminous efficacy, then the luminous efficacy and heat dissipation performance improve, but the distance between light emitting diode chips increases and the device complexity increases
Solution Approach 1:
The lead frame structure is extended in the lateral dimension by adding enlarged regions that protrude beyond the hole cup boundaries. This dimensional extension provides additional wire bonding area without increasing the longitudinal distance between chips, effectively resolving the contradiction between bonding region size and chip spacing.
Solution Approach 2:
The lead frame is segmented into distinct functional regions: the hole cup area for chip mounting and the enlarged regions for wire bonding. This segmentation allows each region to be optimized independently - the hole cup maintains its size for proper chip positioning while the enlarged regions extend outward to provide sufficient bonding area.
2Productivity
If the hole cup size is increased to improve luminous efficacy and heat dissipation, then the luminous efficacy improves, but the wire bonding region becomes insufficient and device complexity increases
Solution Approach 1:
The lead frame is divided into functionally distinct segments - the hole cup region optimized for chip mounting and light extraction, and the enlarged regions optimized for wire bonding. This segmentation allows the hole cup to be sized appropriately for luminous efficacy without compromising wire bonding capability, as the bonding area is provided by the extended enlarged regions.
Solution Approach 2:
Different regions of the lead frame are given different geometric qualities - the hole cup maintains a confined geometry for proper chip positioning and light extraction, while the enlarged regions extend locally to provide additional bonding surface area. This local quality differentiation resolves the contradiction between hole cup size and bonding region availability.
3Area of stationary object
If the distance between light emitting diode chips is reduced to improve compactness, then the package size decreases, but the wire bonding region becomes insufficient
Solution Approach 1:
Instead of increasing bonding area by spreading chips apart (one dimension), the solution extends the lead frame laterally (another dimension) through enlarged regions. This allows compact chip spacing while maintaining adequate bonding region area through vertical/protruding extensions of the lead frame structure.
Solution Approach 2:
The lead frame structure is segmented to separate the chip mounting function (hole cups) from the wire bonding function (enlarged regions). This segmentation allows the bonding regions to be positioned optimally for wire routing regardless of chip spacing, enabling compact packaging while maintaining sufficient bonding area.
Data Source
AI summary
A light emitting diode package includes a first lead frame comprising a first hole cup, a second lead frame comprising a second hole cup and disposed to face the first lead frame with a gap disposed between the first lead frame and the second lead frame, a first light emitting diode chip disposed on the first hole cup, and a second light emitting diode chip disposed on the second hole cup, the first lead frame comprising a first enlarged region formed between the gap and the first hole cup, and the second lead frame comprising a second enlarged region formed between the gap and the second hole cup.