LED Package with Spaced Fluorescent Layer for Heat Management
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Solution Overview
Problem
LEDs coated with a fluorescent substance are prone to deterioration due to heat generated, leading to reduced light efficiency.
Innovation Solution
An LED package design featuring a PCB with an LED mounted on it, a pillar to reflect light, and a transparent plate with a fluorescent layer spaced apart from the LED to convert light into white light, ensuring electrical connectivity and minimizing heat exposure to the fluorescent layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the fluorescent layer is coated directly on the LED chip, then the structure is simple and compact, but the fluorescent layer is deteriorated by heat generated from the LED
Solution Approach 1:
The patent separates the fluorescent layer from the LED chip by introducing a transparent substrate as an intermediate carrier. The fluorescent layer is coated on the substrate rather than directly on the LED, dividing the system into distinct functional modules: LED chip, transparent substrate with fluorescent layer, and supporting structure. This segmentation allows thermal management and optical function to be independently optimized.
Solution Approach 2:
The transparent substrate serves as an intermediary element between the LED chip and the fluorescent layer. It physically separates the heat-generating LED from the heat-sensitive fluorescent material while still allowing optical interaction. The substrate acts as a thermal barrier and mechanical support, enabling the fluorescent layer to be positioned at an optimal distance from the LED for both thermal protection and light conversion efficiency.
2Reliability
If the fluorescent layer is spaced apart from the LED, then heat exposure to the fluorescent layer is reduced, but the device structure becomes more complex
Solution Approach 1:
The transparent substrate performs multiple functions simultaneously: it serves as a mechanical support for the fluorescent layer, a thermal barrier to protect from LED heat, an optical window for light transmission, and a positioning element that maintains optimal spacing. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in overall device complexity despite the spaced-apart configuration.
3Reliability
If a transparent plate is introduced to separate the LED and fluorescent layer, then heat protection is improved, but manufacturing complexity increases
Solution Approach 1:
The fluorescent layer is pre-coated on the transparent substrate before final assembly with the LED chip. This preliminary action allows the fluorescent pattern to be precisely defined and optimized on the substrate independently, and enables thermal protection to be built into the substrate design itself. The pre-assembled substrate-fluorescent layer unit can then be easily integrated with the LED chip, simplifying the overall manufacturing process compared to attempting to apply fluorescent material directly to the LED in the final assembly step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively inhibits fluorescent layer deterioration, maintaining light efficiency and allowing for easy fabrication of the LED package.
Implementation Method 1
a fluorescent layer formed on a surface of the transparent plate, facing the LED, and conformably coated with a substance for converting the light emitted from the LED into white light by changing a wavelength of the light
Data Source
AI summary
The present invention provides a Light Emitting Diode (LED) package, comprising a Printed Circuit Board (PCB), an LED mounted on the PCB, a pillar placed higher than the LED around the LED on the PCB, a transparent plate disposed on the pillar, spaced apart from the LED, and configured to transmit light emitted from the LED, and a fluorescent layer formed on a surface of the transparent plate, facing the LED, and conformably coated with a substance for converting the light emitted from the LED into white light by changing a wavelength of the light, wherein an electrical pad of the LED and an electrical pad of the PCB are electrically connected to each other, and the LED and the fluorescent layer are spaced apart from each other.