LED Package Frame with Insulating Layer for Heat Dissipation
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Solution Overview
Problem
Conventional light-emitting devices face issues with heat dissipation and light extraction efficiency due to the use of ceramic or polymer materials, leading to deteriorated thermal and optical properties, and the reliability is compromised by delamination caused by UV light exposure and differences in thermal expansion coefficients.
Innovation Solution
A light-emitting device design featuring a frame with integrated metal frames and an insulating separation layer, a buffer portion with specific hardness and elongation, and a bonding aid layer for soldering, along with a lens formed by dotting silicone, enhances heat dissipation, light reflection, and prevents delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If ceramic materials are used as package materials, then heat blocking properties are improved, but heat dissipation capability deteriorates
Solution Approach 1:
The package structure is divided into multiple functional layers: a lower reflective layer for heat blocking, a middle light-emitting chip layer, and an upper transparent layer for light extraction. This segmentation allows each layer to specialize in its function without compromising overall performance.
Solution Approach 2:
The patent uses composite material construction with a reflective layer (metal or ceramic) at the bottom and a transparent polymer or glass layer at the top. This composite structure combines the heat-blocking properties of ceramics/metals with the light-transmission properties of polymers/glass, resolving the contradiction between heat blocking and heat dissipation.
2Ease of manufacture
If polymer materials are used as molding materials, then ease of manufacture is improved, but heat dissipation properties deteriorate
Solution Approach 1:
The package is segmented into a polymer molding portion for structural integrity and light extraction, and a separate reflective layer for heat management. This allows the polymer to provide ease of manufacture while the reflective layer handles heat dissipation.
Solution Approach 2:
A reflective layer acts as an intermediary between the polymer molding and the heat-generating light-emitting chip. This intermediary layer provides the heat dissipation function that the polymer lacks, while the polymer continues to provide ease of manufacture and light extraction.
3Temperature
If metal materials are used as package materials, then heat transfer properties are improved, but light reflection efficiency deteriorates
Solution Approach 1:
The patent employs a composite structure where a metal reflective layer is combined with a transparent upper layer. The metal layer provides superior heat transfer properties, while the transparent layer (polymer or glass) provides high light reflection and extraction efficiency, thus resolving the contradiction between heat transfer and light reflection.
4Illumination intensity
If UV light is emitted, then light output is improved, but delamination occurs due to UV exposure and thermal expansion differences
Solution Approach 1:
The patent carefully selects materials with matched thermal expansion coefficients to minimize stress during thermal cycling. Additionally, the adhesive materials are specifically chosen to resist UV degradation, changing the chemical parameters of the bonding materials to prevent delamination under UV exposure and thermal stress.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves thermal and optical performance, increases light extraction efficiency, and ensures reliable operation by effectively dissipating heat and maintaining structural integrity under UV exposure.
Implementation Method 1
The frame (1) is made of a metal material... high heat transfer properties can be ensured
Implementation Method 2
the insulating separation layer (105) extends in a direction parallel to a side wall of the frame portion... electrically insulate the first frame and the second frame
Implementation Method 3
a first bonding aid layer (450) formed on at least a portion of the chip-mounting region... having better wettability to the frame portion than that of the bonding layer
Implementation Method 4
a light-emitting device functions to allow the light generated by supply of electric power to be easily emitted to the outside
Implementation Method 5
The lens portion (7) is made of a transparent material and bonded to the molded portion (3)
Data Source
AI summary
A light-emitting diode package includes a frame portion with a chip-mounting region defined in an upper portion thereof, and first and second frames spaced apart from each other. A light-emitting diode is mounted on at least a portion of the chip-mounting region with a bonding layer interposed therebetween. The frame portion includes a depressed portion formed on an upper surface thereof, and the depressed portion includes the chip-mounting region defined on a bottom thereof. The depressed portion also includes a step portion disposed at an outer upper end thereof.