LED Package Groove Design for Uniform Wavelength Conversion
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Solution Overview
Problem
Conventional light emitting device packages experience non-uniform white light emission due to differences in color characteristics and reduced optical efficiency caused by uneven distribution of wavelength conversion materials, leading to a 'bull's eye' effect and reduced luminous efficiency.
Innovation Solution
A light emitting device package design featuring a package body with sloping sidewalls, a first groove portion around the LED chip, and a second groove portion uniformly spaced from the first, allowing for a uniform thickness of wavelength conversion material to be formed, reducing optical path length and enhancing luminous efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wavelength conversion material is applied around LED chip using conventional dispensing method, then the LED chip can be encased and protected, but the wavelength conversion material is unevenly distributed causing non-uniform color characteristics and bull's eye effect
Solution Approach 1:
The groove portion is formed in advance on the substrate before applying the wavelength conversion material. This preliminary structural preparation ensures that when the material is applied, it is automatically confined to a specific region and distributed uniformly, preventing the bull's eye effect and ensuring consistent color characteristics across the entire emission surface.
Solution Approach 2:
The groove portion creates a localized region with specific geometric constraints around the LED chip. By confining the wavelength conversion material within this groove, the invention ensures uniform thickness and distribution of the material in the critical light emission area, while allowing different regions to have optimized properties for their specific functions.
2Reliability
If cup structure with resin filling is used to mount LED chip, then the chip is protected and positioned, but optical path is extended due to diffusion causing reduced optical efficiency
Solution Approach 1:
The groove portion is formed in advance on the substrate before applying the wavelength conversion material. This preliminary structural preparation ensures that when the material is applied, it is automatically confined to a specific region and distributed uniformly, preventing the bull's eye effect and ensuring consistent color characteristics across the entire emission surface.
Solution Approach 2:
The groove portion creates a localized region with specific geometric constraints around the LED chip. By confining the wavelength conversion material within this groove, the invention ensures uniform thickness and distribution of the material in the critical light emission area, while allowing different regions to have optimized properties for their specific functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design ensures uniform white light emission with improved color temperature and increased luminous efficiency by minimizing optical loss through uniform wavelength conversion material distribution, eliminating the 'bull's eye' effect and optimizing optical path length.
Implementation Method 1
a wavelength conversion portion formed of a resin containing a wavelength conversion material
Data Source
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AI summary
There is provided a light emitting device package including: a package body providing a chip mounting area and including first and second lead terminals; an LED chip mounted on the chip mounting area and electrically connected to the first and second lead terminals; a groove portion disposed around the LED chip in the chip mounting area; and a wavelength conversion portion formed of a resin containing a wavelength conversion material with which to enclose the LED chip and having an outer shape defined by the groove portion.