LED Package with Hard Resin Body for Durability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional LED packages face challenges in durability due to light and heat degradation, and high manufacturing costs as they require enclosures that are prone to degradation, and have inefficient light extraction and complex assembly processes.
Innovation Solution
The LED package design features metal lead frames with a transparent resin body of high shore D hardness, eliminating the need for a separate enclosure and using a simplified manufacturing method that includes wet-etching of conductive sheets to form lead frames and resin integration, enhancing durability and light extraction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a cup-shaped enclosure made of white resin is used to control light distribution, then light extraction efficiency is improved, but the resin portion degrades due to light and heat from LED chips
Solution Approach 1:
The patent removes the cup-shaped white resin enclosure from the LED package structure. Instead of using a separate enclosure to control light distribution, the invention integrates the light extraction function directly into the LED chip mounting structure, eliminating the component that degrades under light and heat exposure.
Solution Approach 2:
The patent employs a composite structure where a reflective layer (such as aluminum or silver) is applied to the inner surface of the transparent resin body, combining the light transmission properties of transparent resin with the light reflection properties of metallic layers to achieve both light extraction efficiency and durability.
2Reliability
If a cup-shaped enclosure with transparent resin is used to bury the LED chip, then light extraction is improved, but manufacturing cost increases
Solution Approach 1:
The patent merges the enclosure function and the light extraction function into a single integrated structure. The transparent resin body serves both as the protective enclosure and as the light extraction medium, eliminating the need for separate components and reducing manufacturing complexity and cost.
Solution Approach 2:
The transparent resin body performs multiple functions simultaneously: it acts as the package enclosure, the light extraction medium, and the mounting substrate for the LED chip. This multi-functionality reduces the number of components needed and simplifies the manufacturing process.
3Reliability
If a cup-shaped enclosure structure is used, then light distribution control is achieved, but device complexity increases
Solution Approach 1:
The patent extracts and removes the complex cup-shaped enclosure structure from the design. Instead of relying on a three-dimensional enclosed structure for light distribution control, the invention uses a simplified planar or shallow structure with reflective surfaces to achieve the same optical control function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the durability and reliability of LED packages by preventing resin degradation, reduces manufacturing costs, and enhances light extraction efficiency while maintaining a wide angle emission, suitable for various applications including illumination and backlighting.
Implementation Method 1
The resin body is made of a resin material having a shore D hardness of 25 or higher
Data Source
AI summary
According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are made of a metal material, and disposed to be apart from each other. The LED chip is provided above the first and second lead frames, the LED chip having one terminal connected to the first lead frame and another terminal connected to the second lead frame. The resin body is made of a resin material having a shore D hardness of 25 or higher. In addition, the resin body covers the first and second lead frames and the LED chip. And, an appearance of the resin body is an appearance of the LED package.