Exposed-Back LED Package with Heat Conductor for Thermal Management
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Solution Overview
Problem
LEDs generate significant heat when electrically driven, which reduces light emitting efficiency, luminance, and shortens their service life, necessitating an effective cooling solution.
Innovation Solution
The LED package design includes a heat-conductive circuit board with a heat conductor and isolator, where the LED's back surface is exposed to directly contact the heat conductor for efficient heat dissipation, and optional heat sinks or heat pipes can be added for further cooling, along with a baffle wall and fluorescent layer for enhanced light extraction and bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If LEDs are electrically driven to emit light, then light emitting efficiency and luminance are improved, but heat generation increases which reduces service life and efficiency
Solution Approach 1:
The patent extracts the heat dissipation function from the traditional LED package structure by exposing the back surface of the LED chip and directly contacting it with the heat conductor of the circuit board. This separation allows the light-emitting front surface to maintain its optical function while the back surface is dedicated to heat removal, resolving the contradiction between luminance generation and heat management.
Solution Approach 2:
The patent introduces a heat conductor as an intermediary component between the LED chip and the circuit board. This heat conductor serves as a thermal bridge that efficiently transfers heat from the LED chip to the circuit board's heat dissipation structure, enabling effective heat removal without interfering with the light-emitting function, thus resolving the temperature-luminance contradiction.
2Reliability
If traditional LED package structures are used with enclosed LED chips, then protection is provided, but heat dissipation efficiency is reduced
Solution Approach 1:
The patent extracts the LED chip from the traditional encapsulated structure and exposes its back surface. This extraction allows direct thermal contact with the heat conductor while the front surface remains protected and optimized for light emission. The LED chip is no longer fully enclosed but rather partially exposed to achieve both protection and heat dissipation.
Solution Approach 2:
The patent applies local quality by differentiating the treatment of the LED chip's front and back surfaces. The front surface maintains its optical properties and is protected for light emission, while the back surface is exposed and directly contacted with the heat conductor for thermal management. This localized differentiation resolves the contradiction between overall protection and localized heat dissipation efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively dissipates heat generated by the LED, improving light emitting efficiency, luminance, and extending the service life by ensuring efficient heat transfer and light extraction.
Implementation Method 1
a heat-conductive circuit board with a heat conductor... the LED's back surface is exposed to directly contact the heat conductor for efficient heat dissipation
Implementation Method 2
a baffle wall and fluorescent layer for enhanced light extraction
Data Source
AI summary
An LED package includes a light transmissive encapsulation, an LED die, a fluorescent layer, a baffle wall, a positive electrode and a negative electrode. The encapsulation includes a light emitting surface and a bottom surface opposite to the light emitting surface. The LED die, the fluorescent layer and the baffle wall are embedded in the encapsulation from the bottom surface side. The LED die includes a front surface for outputting light outward and a back surface opposite to the front surface. The front surface faces the light emitting surface of the encapsulation, and the back surface is exposed outside. The fluorescent layer is formed on the front surface of the LED die. The baffle wall surrounds the LED die and the fluorescent layer. The positive electrode and negative electrode are electrically connected to the LED die.