LED Package with Series-Parallel Chip Arrangement for High Voltage
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Solution Overview
Problem
Conventional light emitting diode (LED) packages are not adequately designed for higher voltage applications, lacking enhanced light output, thermal performance, and reliability, while also being difficult to manufacture efficiently.
Innovation Solution
The design of a light emitting diode package that includes a reflector cavity with LED chips mounted over thermal elements, using a leadframe with heat transfer material and electrical components, and varying the electrical configuration of LED chips in series or parallel arrangements to accommodate higher voltage applications, along with a molded body that encases these components for improved thermal and electrical isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional LED packages are used for higher voltage applications, then the basic LED function is maintained, but light output performance, thermal performance, and reliability are insufficient
Solution Approach 1:
The LED package is segmented into multiple LED chips (e.g., six LED chips) arranged in a specific configuration within the reflector cavity. This segmentation allows the package to handle higher voltage applications by distributing the electrical and thermal load across multiple components, thereby improving reliability and adaptability to higher voltage environments.
Solution Approach 2:
The patent changes key parameters of the LED package including the electrical configuration (series/parallel arrangements of multiple LED chips), thermal management parameters (heat transfer material placement, thermal coupling to heatsink), and optical parameters (reflector cavity design). These parameter changes enable the package to operate effectively in higher voltage applications while maintaining improved reliability.
2Adaptability or versatility
If multiple LED chips are arranged in series configuration for higher voltage applications, then voltage handling capability is improved, but manufacturing complexity increases
Solution Approach 1:
The LED package design incorporates multiple LED chips that can be configured in different electrical arrangements (series, parallel, or combinations) to suit various voltage requirements. This multi-functional approach allows a single package design to accommodate different voltage applications without requiring entirely different package structures, thereby managing complexity while maintaining versatility.
Solution Approach 2:
The patent employs leadframe structures with strategic placement of electrical contacts and conductive paths that create equipotential regions, simplifying the electrical connections between multiple LED chips. This approach reduces the complexity of inter-chip wiring while maintaining the desired series/parallel configurations for higher voltage operation.
3Temperature
If LED chips are thermally coupled to heatsink for improved thermal performance, then heat dissipation is enhanced, but manufacturing precision requirements increase
Solution Approach 1:
The LED package incorporates self-aligning thermal management features where the heat transfer material and heatsink structure are designed to automatically position themselves during the molding process. The molded body encapsulates the thermal components in a way that ensures proper thermal coupling without requiring high-precision manual assembly, thereby enhancing heat dissipation while reducing manufacturing precision requirements.
Solution Approach 2:
The patent merges the thermal management components (heatsink, heat transfer material) with the structural housing (molded body) into an integrated assembly. This combination simplifies the manufacturing process by reducing the number of separate assembly steps and minimizing the need for high-precision alignment, while still achieving effective thermal coupling between LED chips and heatsink.
4Reliability
If molded body encases LED chips and thermal elements for improved thermal and electrical isolation, then reliability is enhanced, but manufacturing process complexity increases
Solution Approach 1:
The molded body serves multiple functions simultaneously: it provides structural support, electrical isolation between components, thermal management through integrated heatsink coupling, and optical shaping for light extraction. This multi-functionality reduces the need for separate components and assembly steps, thereby enhancing reliability while maintaining ease of manufacture through a single molding process.
Solution Approach 2:
The patent combines multiple functions (structural housing, electrical insulation, thermal management interface) into a single molded body component. This integration eliminates the need for separate assembly steps for these functions, simplifying the manufacturing process while ensuring reliable electrical and thermal isolation of the LED chips and thermal elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances light output, thermal performance, and reliability, allowing the LED packages to operate effectively in higher voltage ranges while simplifying the manufacturing process and enabling more efficient heat dissipation.
Implementation Method 1
A representative example of an LED lamp comprises a package having at least one LED chip, a portion of which can be coated with a phosphor such as, for example, yttrium aluminum garnet (YAG). The LED chip can produce an emission of a desired wavelength within the LED lamp, and the phosphor can in turn emit yellow fluorescence with a peak wavelength of about 550 nm on receiving the emission.
Implementation Method 2
The subject matter disclosed herein relates to light emitting diode packages and methods of arranging light emitting diodes within a light emitting diode package for use in higher voltage applications
Data Source
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AI summary
Light emitting devices and methods such as light emitting diodes (LEDs) are disclosed for use in higher voltage applications. Variable arrangements of LEDs are disclosed herein. Arrangements can include one or more LED chips connected in series, parallel, and/or a combination thereof. LED chips can be disposed in a package body having at least one thermal element and one or more electrical components.