LED Package Inclined Cavity Moisture Protection
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Light-emitting device packages face reliability issues due to moisture ingress, which deteriorates their performance and structural rigidity, especially when outside air enters the package.
Innovation Solution
A light-emitting device package design featuring first and second lead frames with an insulation layer, a Zener diode, and a package body with an inclined surface to reflect light, increasing the path for air introduction and enhancing structural rigidity while reducing lead frame thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the package body thickness is increased to protect the light-emitting device from moisture ingress, then reliability is improved, but the light extraction efficiency deteriorates due to increased light absorption by the Zener diode
Solution Approach 1:
The patent introduces a cavity with an inclined surface that redirects light paths in three-dimensional space. Light emitted from the light-emitting device is reflected by the inclined surface away from the Zener diode, changing the spatial dimension of light propagation to avoid absorption while maintaining package body thickness for moisture protection.
Solution Approach 2:
The package body is segmented into functional zones: a cavity region with an inclined reflective surface, a protection region with sufficient thickness for moisture barrier, and a mounting region for the light-emitting device. This segmentation allows different portions to serve different functions - light reflection, moisture protection, and device mounting - simultaneously.
2Volume of moving object
If the lead frame thickness is reduced to decrease package size, then device compactness is improved, but structural rigidity deteriorates
Solution Approach 1:
The patent employs a composite structure combining the lead frame with the package body material. The package body acts as a rigid support structure that compensates for the reduced thickness of the lead frame, maintaining overall structural rigidity while enabling compact dimensions. The insulation layer also contributes to the composite structure providing both electrical isolation and mechanical support.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances reliability by lengthening the air introduction path and increasing structural rigidity, while improving light extraction efficiency by minimizing the absorption of light by the Zener diode.
Implementation Method 1
the cavity has an inclined surface configured to reflect light emitted from the light-emitting device
Data Source
AI summary
A light-emitting device package includes a first lead frame; a second lead frame separated from the first lead frame in a first direction; a package body having a cavity exposing a portion of the second lead frame. Further, the cavity includes an inclined inner surface inclining with respect to an upper surface of the second lead frame; a light-emitting diode disposed on the exposed portion of the second lead frame; a hole in the inclined inner surface of the cavity and exposing a portion of the first lead frame; a protection device disposed in the hole and on the exposed portion of the first lead frame; a first wire having a first end connected to the light-emitting diode, and a second end connected to the first lead frame; a second wire having a first end connected to the light-emitting diode, and a second end connected to the second lead frame; and a third wire having a first end connected to the protection device, and a second end connected to the exposed portion of the second lead frame.