Light-emitting device package with interlocking mold structure

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Solution Overview

Problem

Light-emitting device packages face issues with the molding member separating from the pre-mold under vibration, leading to disconnection of wires connecting the light-emitting device to leads.

Innovation Solution

The molding member is stably bonded to the pre-mold by filling vertical holes on the inclined plane of the pre-mold, which increases the bonding force and prevents separation, even under severe vibrations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a molding member covers the light-emitting device on a pre-mold, then the light-emitting device is protected and encapsulated, but the molding member separates from the pre-mold under vibration

Engineering Contradiction:
Improvebonding stabilityVSAvoidstructural integrity under vibration
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

Vertical holes are pre-formed in the inclined plane of the pre-mold before the molding process. This preliminary structural preparation allows the molding member to be mechanically interlocked with the pre-mold, preventing separation under vibration while maintaining encapsulation functionality.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The pre-mold incorporates a porous structure with vertical holes in its inclined plane. The molding member fills these holes, creating a mechanically interlocked composite structure that enhances bonding stability and prevents separation under vibrational stress.

Inventive Principle:
Principle #31Porous materials

2Reliability

If the molding member is firmly bonded to the pre-mold, then separation is prevented, but the structure becomes more complex

Engineering Contradiction:
Improvebonding strengthVSAvoidmold structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The bonding interface is segmented into multiple vertical holes distributed across the inclined plane. This segmentation distributes the bonding stress across multiple points, enhancing overall bonding strength while maintaining a relatively simple mold structure that can be manufactured using conventional techniques.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS8860073B2Light-emitting device package
Publication Date: 2014.10.14 SAMSUNG ELECTRONICS CO LTD
  • US8860073B2 patent drawing
  • US8860073B2 patent drawing
  • US8860073B2 patent drawing

AI summary

A light-emitting device package may include a pre-mold and a molding member. The pre-mold may include an upper body having a inclined (e.g., concavely) plane from which a plurality of vertical holes passing through the upper body are formed and a lower body having an upper surface that meets the inclined (e.g., concavely) plane under the upper body to form a concave unit. The molding member may fill the plurality of vertical holes and the concave unit.