LED Package Lead Frame Heat Dissipation
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Solution Overview
Problem
Conventional LED packages have complex heat radiation structures that complicate manufacturing, increasing costs and time, and often result in low heat radiation efficiency due to the number of components involved.
Innovation Solution
A simplified LED package configuration using first and second lead frames with a resin package body, where the LED chip is electrically connected to the lead frames and encapsulated with a transparent encapsulant, enhancing heat transfer through the lead frames' large contact area and efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional heat radiation structure with multiple components (heat slug, encapsulant, lens, housing) is used, then heat radiation function is achieved, but device complexity increases and manufacturing becomes complicated
Solution Approach 1:
The patent combines multiple components (heat slug, encapsulant, and lens) into a single integrated structure. The heat radiation unit includes a heat slug with an upper surface that directly contacts the LED chip, eliminating the need for separate mounting structures and reducing the number of assembly steps while maintaining effective heat transfer pathways.
Solution Approach 2:
The heat slug serves multiple functions simultaneously: it acts as a heat sink for thermal management, provides mechanical support for the LED chip, and facilitates electrical connection through its integration with the lead frame. This multi-functionality reduces the overall component count and simplifies the package structure.
2Productivity
If multiple components are assembled to achieve heat radiation, then heat dissipation function is provided, but manufacturing time and costs increase
Solution Approach 1:
The heat slug is pre-formed with the appropriate geometry and thermal conductivity characteristics before assembly. The integrated design allows the heat radiation unit to be prepared in advance as a complete sub-assembly, reducing on-site assembly time and enabling more efficient manufacturing workflows.
Solution Approach 2:
By merging the heat slug, encapsulant, and lens into a single integrated heat radiation unit, the patent eliminates multiple separate assembly operations. This consolidation directly reduces manufacturing time and labor costs while improving production efficiency.
3Device complexity
If a simplified LED package configuration is used, then manufacturing complexity is reduced, but heat radiation efficiency may be compromised
Solution Approach 1:
The heat slug is designed with non-uniform thickness, featuring a first thickness in the first region and a second thickness in the second region. This local variation optimizes heat distribution and radiation efficiency in different areas of the LED package, ensuring effective thermal management despite the simplified overall configuration.
Solution Approach 2:
The patent modifies the physical parameters of the heat slug, specifically its thickness distribution, to optimize heat radiation performance. By changing the thickness parameter across different regions, the design achieves superior heat dissipation while maintaining a simple integrated structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves superior heat radiation efficiency with a simpler configuration, reducing manufacturing complexity and costs while improving heat dissipation by shortening the heat transfer path and increasing the contact area with the circuit board.
Implementation Method 1
enhancing heat transfer through the lead frames' large contact area and efficient heat dissipation
Implementation Method 2
superior heat radiation efficiency with a simpler configuration, reducing manufacturing complexity and costs while improving heat dissipation by shortening the heat transfer path and increasing the contact area with the circuit board
Data Source
AI summary
An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.