LED Package Lead Frame Mounting Without Wire Bonding
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Solution Overview
Problem
The reliability of wire bonding in connecting light emitting diodes (LEDs) to lead frames is a concern, affecting the performance and efficiency of LED-based devices, and existing solutions do not adequately address the need for reliable electrical connection without wire bonding.
Innovation Solution
A light emitting device package design where the LED is mounted between lead frames and sealed with a resin material, allowing for electrical connection without wire bonding, using a body made of light-transmitting materials and a cavity shape that adjusts the orientation of emitted light for improved side lighting and light extraction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect LEDs to lead frames, then electrical connection is achieved, but reliability of the connection deteriorates
Solution Approach 1:
The patent extracts and eliminates the wire bonding process from the LED packaging system. The LED chip is directly mounted on the lead frame without requiring separate wire bonding steps, thereby removing the reliability issues and complexity associated with wire bonding while maintaining electrical connection functionality.
Solution Approach 2:
The patent merges the LED chip mounting process with the electrical connection process. By integrating the LED chip directly onto the lead frame structure, the invention combines mechanical support and electrical connection into a single unified structure, eliminating the need for separate wire bonding operations.
2Reliability
If LED is mounted between lead frames without wire bonding, then connection reliability improves, but manufacturing precision requirements worsen
Solution Approach 1:
The lead frame is pre-designed with integrated contact structures and mounting features that guide the LED chip into proper alignment before final bonding. This preliminary structuring of the lead frame reduces the precision requirements during the actual LED mounting process by providing built-in alignment references and contact points.
3Reliability
If resin material is used to seal the LED, then protection and light extraction are improved, but heat dissipation worsens
Solution Approach 1:
The patent employs composite material structures in the sealing and heat management system. The lead frame itself serves as both a structural support and a heat dissipation pathway, while the resin encapsulant provides protection and optical functionality. This composite approach allows the resin to perform its protective and optical functions without bearing the heat dissipation burden, which is handled by the metal lead frame structure.
Data Source
AI summary
The light emitting device package includes a body provided with a cavity, a first lead frame mounted on the body, a second lead frame mounted on the body and separated from the first lead frame, and a light emitting device mounted in the cavity and disposed between the first lead frame and the second lead frame, the light emitting device is formed by sequentially stacking a first conductivity-type semiconductor layer, an active layer and a second conductivity-type semiconductor layer, the sequentially stacking direction of the first conductivity-type semiconductor layer, the active layer and the second conductivity-type semiconductor layer is parallel with the bottom surface of the cavity, the first lead frame includes a first connection part electrically connected to the first conductivity-type semiconductor layer, and the second lead frame includes a second connection part electrically connected to the second conductivity-type semiconductor layer.