Light-emitting Package Lead Frame Segmentation for Sealing

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Solution Overview

Problem

The existing light-emitting device packages face issues with sealing performance due to separation of lead frames from the package body, allowing moisture and foreign substances to permeate, which deteriorates the package's integrity.

Innovation Solution

The design includes lead frames with a connection portion of smaller width between the lower surface and sidewall of the cavity and the top surface and outer side surface of the package body, featuring through-holes and recesses to enhance coupling with the package body, using materials like polyphthalamide resin, and introducing a molding portion to protect the light-emitting device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the lead frames are made wide to ensure structural strength, then the mechanical strength is improved, but the sealing performance deteriorates due to separation from the package body

Engineering Contradiction:
Improvemechanical strengthVSAvoidsealing performance
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The lead frame is divided into multiple sections: a first portion in the cavity, a second portion on the package body, and a connection portion between them. The connection portion has a reduced width compared to the other portions, creating a segmented structure that prevents separation while maintaining overall strength.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different portions of the lead frame have different widths tailored to their specific functions. The connection portion has a locally reduced width to prevent separation at the critical interface between the cavity and package body, while other portions maintain sufficient width for structural support.

Inventive Principle:
Principle #3Local quality

2Reliability

If the connection portion width is reduced to prevent separation, then the sealing performance is improved, but the mechanical strength may be compromised

Engineering Contradiction:
Improvesealing performanceVSAvoidmechanical strength
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The lead frame is divided into multiple sections: a first portion in the cavity, a second portion on the package body, and a connection portion between them. The connection portion has a reduced width compared to the other portions, creating a segmented structure that prevents separation while maintaining overall strength.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different portions of the lead frame have different widths tailored to their specific functions. The connection portion has a locally reduced width to prevent separation at the critical interface between the cavity and package body, while other portions maintain sufficient width for structural support.

Inventive Principle:
Principle #3Local quality

3Reliability

If the lead frames are secured tightly to the package body, then the sealing performance is improved, but the device complexity increases due to additional coupling structures

Engineering Contradiction:
Improvesealing performanceVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Different portions of the lead frame have different widths tailored to their specific functions. The connection portion has a locally reduced width to prevent separation at the critical interface between the cavity and package body, while other portions maintain sufficient width for structural support.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The reduced width of the connection portion creates a self-coupling effect where the lead frame naturally adheres to the package body through the molding material, eliminating the need for additional fastening structures or complex coupling mechanisms.

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS10672961B2Light-emitting element package having lead frame with connection portion
Publication Date: 2020.06.02 SUZHOU LEKIN SEMICON CO LTD
  • US10672961B2 patent drawing
  • US10672961B2 patent drawing
  • US10672961B2 patent drawing

AI summary

A light-emitting element package includes a package body having a cavity; a first lead frame and a second lead frame disposed on the package body; a light-emitting element disposed on the bottom surface of the cavity and electrically connected to the first lead frame and the second lead frame; and a molding part surrounding the light-emitting element and disposed in at least a portion of the cavity. Each of the lead frames includes a first part corresponding to a portion of the bottom surface and side walls of the cavity; a second part corresponding to a portion of an upper surface and outer side surfaces of the package body; and a connection part disposed between the first part and the second part width of the connection part is narrower than the width of the first part and the second part in a region adjacent to the connection part.