LED Package Thermal Conduction via Liquid Medium
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Solution Overview
Problem
Conventional LED package structures face challenges in effectively managing heat generated by LED chips, particularly when driven under high current, leading to potential damage due to overheating.
Innovation Solution
Incorporating a thermal-conductive transparent liquid within a sealed space that includes a carrier substrate with embedded channels or conductive vias, and a thermal-conductive structure, which enhances thermal conduction efficiency by contacting the LED chip's bottom, sidewalls, and top, while also using a thermal-conductive substrate and optical element to facilitate heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional LED package structure is used, then the structure is simple and easy to manufacture, but the thermal conduction efficiency is insufficient leading to overheating
Solution Approach 1:
The patent introduces a thermal-conductive transparent liquid as an intermediary substance that fills the sealed space and contacts the LED chip's sidewalls and top surface. This liquid mediator transfers heat from the LED chip to the carrier substrate and thermal-conductive structure, solving the thermal conduction problem without requiring direct solid-to-solid contact on all surfaces, thus improving reliability while maintaining reasonable structural complexity
Solution Approach 2:
The patent utilizes a liquid-based thermal conduction system where the thermal-conductive transparent liquid acts as a hydraulic/thermal medium to transport heat away from the LED chip. This approach replaces traditional solid thermal interface materials and allows for complete coverage of the LED chip surfaces, enhancing thermal conduction efficiency while keeping the structure manageable
2Illumination intensity
If high current is applied to LED chip, then the illumination intensity increases, but the heat generation increases causing overheating and potential damage
Solution Approach 1:
The patent converts the harmful heat generated by high-current operation into a manageable thermal conduction problem. By introducing the thermal-conductive transparent liquid and enhanced thermal conduction pathways (embedded channels, conductive vias, thermal-conductive structure), the system efficiently transfers the necessarily generated heat away from the LED chip, allowing high illumination intensity to be maintained without reaching damaging temperatures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves thermal conduction efficiency, reducing the risk of overheating and enhancing the reliability and performance of LED packages by effectively dissipating heat generated during illumination.
Implementation Method 1
the thermal-conductive transparent liquid fills up the sealed space. Accordingly, the carrier substrate and the thermal-conductive structure below the LED chips help to increase the thermal conduction efficiency of the bottom of the LED chip, and the thermal-conductive transparent liquid in contact with the LED chip helps to increase the thermal conduction efficiency of the sidewall and top of the LED chip
Data Source
AI summary
A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The thermal-conductive transparent liquid fills up the sealed space.