LED Package Metal PCB Heat Dissipation
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Solution Overview
Problem
Conventional LED packages with metal PCBs face challenges in achieving a compact structure, efficient heat dissipation, and compatibility with conventional electronic devices due to their large thickness, lack of lead structures, and uneven mounting surfaces caused by groove machining processes.
Innovation Solution
A metal PCB is formed by laminating first and second sheet metal plates with an insulating layer, featuring electrode patterns and leads extending from the first sheet metal plate, which are bent to create an enlarged contact area with external electrodes, and a hole cup is formed around the LED chip to adjust light direction without requiring additional machining, using materials like copper, resin, or ceramic.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional metal PCB with groove machining is used, then heat dissipation is improved, but the structure becomes non-compact and manufacturing becomes difficult
Solution Approach 1:
The metal PCB is segmented into multiple layers: a first metal layer for heat dissipation, an insulating layer, and a second metal layer for electrical connections. This segmentation allows each layer to perform its specific function optimally while maintaining overall compactness
Solution Approach 2:
The patent transitions from a single-plane groove machining approach to a multi-layer stacked structure, adding the vertical dimension to achieve both heat dissipation and compactness simultaneously
2Temperature
If groove machining is used to form hole cup, then heat dissipation is improved, but mounting surface becomes uneven and chip attachment becomes difficult
Solution Approach 1:
The mounting function is separated from the heat dissipation function by placing the LED chip on the flat first metal layer, while the groove is formed in the second metal layer, allowing both functions to coexist without interference
Solution Approach 2:
The insulating layer acts as an intermediary between the groove structure and the mounting surface, isolating the uneven groove from the chip mounting area and maintaining surface flatness
3Temperature
If conventional metal PCB without lead structure is used, then heat dissipation is improved, but compatibility with conventional electronic devices is reduced
Solution Approach 1:
The second metal layer serves multiple functions: it provides electrical connection through lead structures for compatibility with conventional devices, while also contributing to heat dissipation alongside the first metal layer
Solution Approach 2:
The lead structures in the second metal layer are designed to be bendable, allowing adaptation to different mounting configurations and external electrode arrangements, enhancing versatility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides superior heat dissipation, a compact structure, and compatibility with conventional devices, allowing for easier chip attachment and improved mechanical strength, while utilizing existing manufacturing equipment and avoiding the need for complex machining processes.
Implementation Method 1
heat generated from an LED chip has a direct influence on the light emitting performance and life span of the LED package... a separate device for effectively dissipating the generated heat is required
Implementation Method 2
a metal printed circuit board (metal PCB) in which an insulating layer and a metal pattern layer are sequentially formed on an aluminum base
Data Source
AI summary
The present invention relates to a light emitting diode (LED) package. An object of the present invention is to provide an LED package having a metal PCB, which has a superior heat dissipation property and a compact structure, does not largely restrict use of conventional equipments, and is compatible with an electronic device or illumination device currently used widely. To this end, an LED package according to the present invention comprises a metal printed circuit board (PCB) formed by laminating first and second sheet metal plates with an electric insulating layer interposed therebetween; and an LED chip mounted on the first sheet metal plate of the metal PCB, wherein the first sheet metal plate has electrode patterns and leads respectively extending from the electrode patterns.