Light Emitting Device Package With Metal Plate For Heat Dissipation
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Solution Overview
Problem
Existing light emitting device packages face challenges in effectively managing thermal resistance, which affects the efficiency and reliability of light emission and heat dissipation.
Innovation Solution
A light emitting device package design featuring a package body with a cavity, insulating layers, metal layers, and a metal plate positioned between the package body and the semiconductor device to enhance heat radiation, utilizing a silicon material and a thin metal plate for improved heat transfer and radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional package structure without a metal plate is used, then the device complexity is reduced, but the thermal resistance increases and heat dissipation efficiency deteriorates
Solution Approach 1:
A metal plate is introduced as an intermediary component between the package body and the semiconductor device. This metal plate serves as a thermal conductor to improve heat dissipation from the light emitting device, while the insulating layer acts as a mediator to provide electrical isolation. The intermediary components resolve the thermal management issue without requiring complete redesign of the entire package structure.
Solution Approach 2:
The package structure employs composite material arrangement by combining metal layers with high thermal conductivity for heat dissipation, insulating layers with low thermal conductivity for electrical isolation, and resin materials for structural support. This composite approach allows simultaneous optimization of thermal and electrical properties within the package.
2Temperature
If the package body is made of silicon material with a cavity, then the heat radiation capability is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The package body is designed with a cavity structure that creates local quality differences - the cavity region provides enhanced heat radiation capability while other regions maintain structural integrity. The metal plate is strategically positioned at specific locations (under the light emitting device or on the package body) to provide localized thermal management where it is most needed, rather than requiring uniform thermal properties throughout the entire structure.
3Productivity
If a metal plate is disposed between the package body and the semiconductor device, then the heat transfer efficiency is improved, but the device complexity increases
Solution Approach 1:
The metal plate functions as a thermal intermediary that facilitates efficient heat transfer from the semiconductor device to the package body. By positioning the metal plate at strategic locations rather than throughout the entire structure, the design achieves improved heat transfer efficiency while minimizing the increase in structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves thermal resistance and light emission efficiency by effectively conducting and radiating heat, enhancing the reliability and performance of the light emitting device package.
Implementation Method 1
a first metal plate disposed under the package body at a region corresponding to the light emitting device
Implementation Method 2
a first and second metal layers on the cavity of the package body
Data Source
AI summary
A light emitting device package and a method for manufacturing the same are provided. The light emitting device package comprises a package body comprising a cavity at an upper portion; a first and second metal layers on the cavity of the package body; an open area recessed in the cavity; a first metal plate disposed in the open area and spaced apart from the first and second metal layers; a semiconductor device disposed on the first metal plate and electrically connected to at least one of the first and the second metal layers; and a resin material in the cavity.