LED Package Metallic Reflecting Portions Enhance Luminous Efficiency
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Solution Overview
Problem
Conventional LED packages suffer from reduced luminous efficiency due to light transmission through the reflector, which is typically made of polyphthalamide, rather than reflection, leading to light loss.
Innovation Solution
The LED package incorporates angled and semi-elliptical metallic conductors with reflecting portions that surround the semiconductor chip, configured to reflect light back into the package, reducing light transmission through the frame and enhancing luminous efficiency by optimizing the angles and curvatures of these reflecting elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a polyphthalamide (PPA) reflector is used in the LED package, then the structural integrity and electrical insulation are maintained, but light transmission occurs through the reflector instead of reflection, reducing luminous efficiency
Solution Approach 1:
The reflector is constructed as a composite structure combining a PPA base layer with a metallic reflective layer (aluminum or silver) deposited on its inner surface. This composite design maintains the structural and insulating properties of PPA while the metallic layer provides high reflectivity to prevent light transmission, thereby resolving the contradiction between structural integrity and light reflection efficiency
Solution Approach 2:
The reflector's optical parameters are modified by changing its material composition from pure PPA to a PPA-metal composite. This parameter change transforms the reflector from a light-transmissive material to a light-reflecting material, eliminating the harmful light transmission effect while preserving the beneficial structural properties
2Reliability
If the reflector is made of polyphthalamide material, then electrical insulation and structural stability are provided, but light beams transmit through rather than reflect, causing energy loss
Solution Approach 1:
The reflector combines PPA material with a metallic reflective coating to create a composite structure that simultaneously provides electrical insulation and structural stability from the PPA layer, while the metallic layer prevents light transmission through high reflectivity, thus resolving the contradiction between structural reliability and energy conservation
3Ease of manufacture
If conventional PPA reflector design is used, then manufacturing simplicity is maintained, but luminous efficiency is depressed due to light transmission
Solution Approach 1:
The reflector is manufactured as a composite by depositing a metallic reflective layer onto a PPA substrate using standard coating techniques. This approach maintains relative manufacturing simplicity while dramatically improving light reflection performance, resolving the contradiction between ease of manufacture and reduction of light loss
Solution Approach 2:
The reflector's optical parameters are enhanced by adding a metallic coating layer, which changes the material's light interaction properties from transmissive to reflective. This parameter modification achieves high luminous efficiency while maintaining compatibility with existing manufacturing processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly improves light reflection and reduces light loss, thereby enhancing the luminous efficiency of the LED package by ensuring that light beams from the semiconductor chip are effectively reflected back into the package, rather than transmitted through the frame.
Implementation Method 1
The first metallic conductor 21 has a first reflecting portion 212 extending into the insulated frame 20, and the second metallic conductor 22 has a second reflecting portion 222 extending into the insulated frame 20... both are substantially semi-elliptical rings... cooperates with the second reflecting portion 212 to surround the receiving groove 202, to prevent light beams from the radiation emitting semiconductor chip 23 from transmitting through the insulated frame 20
Data Source
AI summary
An LED package includes an insulated frame, a first metallic conductor and a second metallic conductor, a chip and an encapsulation. The insulated frame has a receiving groove defined therein. The two metallic conductors are both mounted on bottom of the insulated frame and separated from each other. The chip is placed in the receiving groove and electrically connected to the two metallic conductors. The encapsulation is located in the receiving groove. The first metallic conductor and the second metallic conductor each comprise a mounting portion exposed to the receiving groove and a reflecting portion extending from the mounting portion into the insulated frame. The first reflecting portion and the second reflecting portion cooperatively surround the receiving groove of the insulated frame.