LED Package Structure with Partition for Compact Light Mixing
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Solution Overview
Problem
Conventional LED package structures require a longer optical distance for effective light mixing, leading to incomplete mixing and interference from other colors, which hinders the production of uniform white light.
Innovation Solution
The LED package structure incorporates a first light emitting portion, a second light emitting portion, a partition, and a surrounding wall, where the partition is shorter than the surrounding wall, and the second light emitting portion has a greater volume, allowing for a reduced optical distance and improved light mixing by arranging LED chips to emit red, green, and blue initial lights with specific view angles and using a wavelength conversion element and encapsulant with a diffuser.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the optical distance is increased to improve light mixing uniformity, then the white light quality improves, but the device size and working distance increase
Solution Approach 1:
The patent divides the light emitting structure into multiple portions (first light emitting portion with blue LED and phosphor, second light emitting portion with RGB LED chips) separated by a partition. This segmentation allows each portion to contribute specific wavelengths to the overall white light output, achieving effective light mixing over a shorter optical distance by distributing light sources strategically rather than relying on a single extended source.
Solution Approach 2:
The patent utilizes vertical stacking of LED chips and phosphor layers in the second light emitting portion, arranging RGB chips at different heights and positions. This three-dimensional arrangement enables comprehensive wavelength coverage and improved light mixing uniformity within a compact footprint, reducing the required optical distance while maintaining effective spectral integration.
2Length of stationary object
If the optical distance is shortened to reduce device size, then the device becomes more compact, but the light mixing becomes incomplete and color interference increases
Solution Approach 1:
The patent assigns different functional qualities to different regions: the first light emitting portion generates blue light converted to white by phosphor, while the second light emitting portion provides direct RGB emission. The partition creates localized emission zones with specific spectral characteristics, and the surrounding wall confines and directs light paths. This localized functional differentiation ensures effective light mixing within a shortened optical distance by optimizing each region's contribution to the overall spectrum.
3Stability of the object's composition
If multiple LED chips are arranged to improve light mixing, then the light mixing effect improves, but the device complexity increases
Solution Approach 1:
The patent combines multiple LED chips (blue LED, red LED chip, green LED chip, and additional blue LED chip) and phosphor materials within a single integrated package structure. The first and second light emitting portions are merged into one compact assembly with a unified surrounding wall and partition, eliminating the need for separate mounting structures and simplifying the overall device architecture while achieving comprehensive wavelength coverage and improved light mixing uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the optical distance from 8 mm to 2 mm, enhances light mixing uniformity, and increases the view angle of the white light, resulting in improved light exiting angles and reduced chip requirements, facilitating miniaturization and cost-effectiveness in electronic devices.
Implementation Method 1
a wavelength conversion element containing phosphor, and the wavelength conversion element covers the first LED chip
Implementation Method 2
the encapsulant contains a diffuser
Data Source
AI summary
A light emitting diode (LED) package structure including a first light emitting portion, a second light emitting portion, a partition, and a surrounding wall is provided. The first light emitting portion includes a first LED chip emitting a first initial light, and the first initial light passes through the first light emitting portion to form a first white light. The second light emitting portion includes a second LED chip, a third LED chip, and a fourth LED chip. The partition is disposed between the first light emitting portion and the second light emitting portion. The surrounding wall is disposed around the partition, the first light emitting portion, and the second light emitting portion. The first white light has a view angle offset less than 1 degree.