LED Package Uniform Phosphor Encapsulation
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Solution Overview
Problem
Conventional LED packages face challenges in achieving uniform encapsulation of the phosphor layer around the LED chip due to the viscosity of the molding resin, leading to incomplete coverage and potential oxidation of the LED chip and electrode.
Innovation Solution
A holding part made of transparent material, such as silicon, is used to securely position the phosphor layer around the LED chip, with a transparent resin layer preventing oxidation and a lens to focus the wavelength-converted light, ensuring uniform encapsulation and light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If molding resin containing phosphors is applied on the LED chip using a dispenser, then the phosphor layer can be formed, but the resin may only partially encapsulate the LED chip or flow down due to viscosity, resulting in non-uniform encapsulation
Solution Approach 1:
A support structure is formed beforehand on the LED chip before applying the phosphor-containing resin. This preliminary structure provides a framework that guides the resin flow and ensures complete encapsulation of the LED chip, eliminating the problem of partial coverage or unwanted flow down during the encapsulation process.
Solution Approach 2:
The support structure acts as an intermediary element between the LED chip and the phosphor-containing resin. It mediates the interaction by providing a controlled interface that manages resin flow and distribution, ensuring uniform encapsulation without requiring precise viscosity control of the resin itself.
2Reliability
If the phosphor layer does not completely encapsulate the LED chip, then the manufacturing process is simpler, but the LED chip and electrode are exposed to oxidation
Solution Approach 1:
The support structure is formed in advance on the LED chip to create a predefined encapsulation framework. This preliminary action ensures that when the phosphor-containing resin is applied, it will completely cover the LED chip and electrode, providing oxidation protection without requiring complex additional structures or processes.
Solution Approach 2:
The phosphor-containing resin forms a thin film encapsulation layer that completely covers the LED chip and electrode when guided by the support structure. This thin film provides effective oxidation protection while maintaining simplicity in the overall device structure, avoiding the need for bulky or complex protective components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables uniform encapsulation of the phosphor layer, preventing oxidation and enhancing the reliability and brightness of the LED package by ensuring complete coverage and focused light emission.
Implementation Method 1
a phosphor layer held by the holding part to seal a space defined by the holding part, the phosphor layer converting a wavelength of the light from the LED chip
Implementation Method 2
The holding part may be formed of a transparent material transmitting the wavelength-converted light
Implementation Method 3
The LED package may further include a lens focusing the wavelength-converted light
Data Source
AI summary
There is provided a light emitting diode (LED) package in which a phosphor layer encapsulating an LED chip is formed uniformly to facilitate a process. The LED package includes: a package body having a mounting area; a holding part mounted on the mounting area to expose a portion of the mounting area; an LED chip mounted on the mounting area, the LED chip surrounded by the holding part to emit light; and a phosphor layer held by the holding part to seal a space defined by the holding part, the phosphor layer converting a wavelength of the light from the LED chip.