Light Emitting Device Package Protective Layer
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Solution Overview
Problem
Current light emitting devices, such as LEDs, face challenges in enhancing light extraction efficiency, heat radiation, and electrical discharge resistance, particularly due to limitations in the materials used for protective layers, which affect the luminous flux and reliability of the devices.
Innovation Solution
A protective layer composed of a composite material including silicon resin, boron nitride (BN), and aluminum nitride (AlN) is introduced, which improves light extraction efficiency, heat radiation, and electrical discharge resistance by increasing reflectance and heat dissipation, while also reducing the height of the phosphor layer to enhance reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional protective layer material is used, then the device structure is simple, but the light extraction efficiency is low
Solution Approach 1:
The protective layer is formed as a composite material containing silicon resin and white pigment, combining the protective function of the resin with the light-reflecting function of the white pigment to achieve both structural simplicity and high light extraction efficiency
2Reliability
If the phosphor layer height is increased, then the light extraction efficiency may improve, but the device reliability decreases
Solution Approach 1:
The protective layer acts as an intermediary between the phosphor layer and the external environment, providing light reflection functionality that compensates for the reduced phosphor layer height, thereby maintaining light extraction efficiency while improving device reliability
3Temperature
If the protective layer material has high heat dissipation, then the heat radiation improves, but the material selection becomes more restrictive
Solution Approach 1:
The protective layer's heat dissipation parameter is optimized by incorporating white pigment with specific thermal properties into the silicon resin matrix, achieving improved heat radiation while maintaining material versatility through the flexible composite formulation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of a BN and AlN composite in the protective layer enhances light extraction efficiency by 7%, improves heat radiation, and increases electrical discharge resistance, thereby improving the overall performance and reliability of the light emitting device package.
Implementation Method 1
improves light extraction efficiency by 7%... by increasing reflectance
Implementation Method 2
improves heat radiation... by increasing reflectance and heat dissipation
Implementation Method 3
increases electrical discharge resistance
Data Source
AI summary
A light emitting device package is provided. The light emitting device package may include a package body, a circuit pattern on the package body, a light emitting chip on the circuit pattern, a connector to connect the light emitting chip to the circuit pattern, a phosphor layer on the light emitting chip, and a first protective layer including a Group III nitride provided on the package body to cover the circuit pattern, the light emitting chip, and the connecting member.