Light Emitting Device Package with Recessed Body for Thermal Management
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Solution Overview
Problem
Light emitting device packages face challenges in providing high output, improving light extraction efficiency, and enhancing bonding strength between the electrode and the light emitting device, while also preventing defects due to temperature changes and external heat.
Innovation Solution
A light emitting device package design featuring a body with recesses between frames, spacers, and a conductive layer, which includes protrusions and recesses to enhance light extraction, electrical properties, and thermal buffering, and uses resins to secure the bonding portions and prevent re-melting during re-bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high power is applied to achieve high output, then light output increases, but thermal deformation and defects occur
Solution Approach 1:
The patent introduces a body with recesses positioned between the light emitting device and the electrode to absorb and cushion thermal deformation before it reaches critical components. This cushioning structure prevents defects by accommodating expansion and contraction during thermal cycling, thereby maintaining reliability under high power operation.
2Stability of the object's composition
If the body structure is made rigid to maintain structural stability, then structural stability improves, but thermal deformation causes defects
Solution Approach 1:
The patent employs a body with recesses that creates a flexible or compliant structure rather than a completely rigid one. This flexible design allows the body to accommodate thermal expansion and contraction without generating excessive stress that would lead to defects, while still maintaining overall structural stability.
3Ease of manufacture
If the package structure is simplified to reduce manufacturing complexity, then ease of manufacture improves, but light extraction efficiency decreases
Solution Approach 1:
The patent segments the body into multiple portions with recesses at different locations and depths. This segmentation allows each recess to serve specific functions for light extraction while maintaining a relatively simple overall manufacturing process. The segmented structure improves light extraction efficiency without significantly increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents defects from thermal deformation, improves light extraction efficiency, enhances electrical reliability, and reduces manufacturing costs by providing a cushioning structure and high reflectance, thereby preventing re-melting and improving the overall reliability of the semiconductor device package.
Implementation Method 1
a first reflective portion and a second reflective portion; the first reflective portion is disposed on the body and spaced from the first bonding portion, and the second reflective portion is disposed on the body and spaced from the second bonding portion
Data Source
AI summary
The light emitting device package disclosed in an embodiment of the invention includes first and second frames; a body disposed between the first and second frames; and a light emitting device disposed on the first and second frames, wherein the first frame includes a first end portion adjacent to the second frame, and the second frame includes a second end portion adjacent to the first frame and facing the first end portion, wherein the first end portion includes a first protruding portion protruding toward the second frame, and the second end portion includes a second protruding portion protruding toward the first frame. The light emitting device may include a first bonding portion disposed on the first protruding portion and a second bonding portion disposed on the second protruding portion.