LED Package With Reflective Insulating Layer

The patent introduces a vertical stacking architecture where multiple LED chips are arranged in layers with alternating orientations (first direction, second direction perpendicular to first). This three-dimensional arrangement allows light to be extracted from multiple directions and surfaces, significantly improving overall light extraction efficiency while maintaining manufacturing feasibility through standardized chip mounting procedures.

The patent divides the LED package into multiple discrete chip units mounted on a substrate, with each chip independently oriented and connected through conductive structures. This segmentation allows for optimized light extraction from each individual chip while maintaining overall package simplicity, and enables modular manufacturing approaches.

The patent employs a unified substrate structure that simultaneously provides mechanical support, electrical connection pathways, and thermal management functions. The conductive structures serve multiple purposes: establishing electrical connections between vertically stacked chips, providing mechanical anchoring points, and facilitating heat dissipation. This multi-functionality reduces the need for separate specialized components, thereby maintaining reliability while simplifying the overall device architecture.

The patent integrates multiple functional elements into consolidated structures. The conductive structures combine electrical interconnection and mechanical support functions; the substrate integrates mounting, routing, and thermal management; and the reflective structures are incorporated directly into the package housing rather than being separate components. These mergers reduce the number of discrete parts and assembly steps while maintaining reliable electrical connections.