LED Package Reflective Layer for Higher Light Flux
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Solution Overview
Problem
Semiconductor device packages face issues with light flux degradation due to metal lead frames absorbing light, and coatings like silver can degrade the surface and reliability.
Innovation Solution
A semiconductor device package design featuring a substrate with lead frames, a reflective layer to enhance light reflection, and a lens to control directivity, along with a wavelength conversion layer to improve light flux and directivity angle.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lead frames are made of metal material such as gold, then electrical connection is achieved, but light is absorbed and light flux is degraded
Solution Approach 1:
A transparent resin layer is introduced as an intermediary substance between the metal lead frame and the light emitting device. This resin layer allows electrical connection to be maintained while preventing direct contact between metal and light, thereby eliminating light absorption by the lead frame and improving light flux.
2Illumination intensity
If lead frame is coated with silver, then light reflection is improved, but surface is discolored and reliability is degraded
Solution Approach 1:
Instead of using expensive silver coating that degrades over time, the patent uses a transparent resin material that is cost-effective and provides durable light reflection without discoloration. The resin material maintains its optical properties over time, ensuring long-term reliability without the surface degradation issues of silver coatings.
3Illumination intensity
If reflective layer is added to improve light flux, then light extraction efficiency is improved, but device complexity increases
Solution Approach 1:
The patent combines the transparent resin layer with the lead frame structure to form an integrated component. The resin is filled into the lead frame's recessed portions, merging the electrical connection function and light extraction function into a single integrated structure, thereby improving light flux without significantly increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves light flux and controls directivity angle, enhancing the overall light extraction efficiency and reliability of the semiconductor device package.
Implementation Method 1
a reflective layer disposed on the substrate and configured to reflect light emitted from the light emitting device
Implementation Method 2
a lens disposed on the substrate and configured to cover the light emitting device, the reflective layer, the first and second lead frames
Data Source
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AI summary
Disclosed is a semiconductor device package according to an embodiment, the semiconductor comprising: a substrate; first and second lead frames arranged on the substrate; a light emitting element electrically connected to the first and second lead frames; a reflective layer arranged on the substrate so as to reflect the light emitted from the light emitting element; and a lens arranged on the substrate so as to cover the light emitting element, the reflective layer, and the first and second lead frames.