LED Package Heat Sink Groove and Reflector Design
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Solution Overview
Problem
The existing LED package structure faces challenges in processing inclined reflection holes, forming reflective coatings with Ag metal, and limited depth due to PCB thickness, making it difficult to achieve high brightness and uniform light distribution.
Innovation Solution
The proposed LED package incorporates a heat sink with a groove for the LED, a reflector coupled to the heat sink with a lead frame for electrical connection, and a molding unit for improved heat dissipation and light efficiency, using a plastic reflector and epoxy or silicon for enhanced brightness distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a reflective coating layer is formed in an inclined reflection hole on the PCB, then light reflection efficiency is improved, but manufacturing complexity and difficulty increase
Solution Approach 1:
Instead of forming an inclined reflection hole in the PCB and coating it with reflective material, the patent inverts the approach by placing a separate reflector component with reflective coating underneath the LED, eliminating the need for complex PCB hole processing and reflective coating application.
Solution Approach 2:
The patent separates the reflector function from the PCB structure by using a distinct reflector component. This segmentation allows the reflector to be independently manufactured and positioned, simplifying the overall manufacturing process while maintaining light reflection efficiency.
2Length of stationary object
If the PCB thickness is limited, then the device remains thin and compact, but the depth of the reflection hole is restricted
Solution Approach 1:
The patent moves the reflection hole depth requirement from the PCB plane to the vertical dimension by placing the LED and reflector assembly on the PCB surface. This allows sufficient reflection depth without increasing PCB thickness, as the reflector extends downward from the LED rather than requiring deep holes in the PCB.
3Loss of energy
If Ag metal is used for reflective coating, then light reflection efficiency is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent replaces the expensive and complex Ag metal reflective coating with a more economical reflector material that provides sufficient reflection efficiency. This substitution reduces manufacturing cost and complexity while maintaining adequate light reflection performance for the application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration simplifies manufacturing, reduces weight, and enhances heat dissipation and light efficiency, allowing for higher brightness and uniform light distribution, suitable for both line and surface light sources.
Implementation Method 1
heat sink having a groove
Implementation Method 2
heat sink having a groove
Implementation Method 3
reflector coupled to the heat sink... enhance brightness distribution
Implementation Method 4
molding unit on the light emission diode... uniform light distribution
Implementation Method 5
lead frame included in the reflector and electrically connecting the light emission diode to the printed circuit board
Data Source
AI summary
Provided is a light emission diode package and a fabricating method thereof. The light emission diode package includes a heat sink having a groove, a printed circuit board on the heat sink, a light emission diode on the groove, a reflector coupled to the heat sink, a lead frame included in the reflector and electrically connecting the light emission diode to the printed circuit board and a molding unit on the light emission diode.