LED Package Structure With Reusable Substrate and Transparent Conductor

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Solution Overview

Problem

Conventional light-emitting diode package manufacturing methods are inefficient and costly due to complex steps and the inability to reuse substrates, leading to reduced yield and increased costs.

Innovation Solution

A manufacturing method involving a substrate with a patternable material layer, where light-emitting diodes and dummy plugs are arranged, coated, patterned, and connected via a conductive layer, allowing for substrate separation and reuse, with the conductive layer made from indium tin oxide or transparent conductive materials to improve efficiency and yield.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional wire bonding and gel packaging methods are used, then electrical connection is achieved, but the manufacturing process becomes complicated and efficiency decreases

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidmanufacturing process complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the wire bonding step from the conventional manufacturing process by directly integrating the conductive layer into the package structure during molding, thereby simplifying the process and improving efficiency

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the electrical connection function and packaging function into a single integrated structure where the conductive layer serves both purposes, eliminating the need for separate wire bonding and gel packaging steps

Inventive Principle:

Principle #5Merging (Combining)

2Ease of manufacture

If conventional substrates are used, then light-emitting diodes can be mounted, but the substrates cannot be reused and manufacturing cost increases

Engineering Contradiction:

Improvesubstrate reuse capabilityVSAvoidsubstrate disposal

Core Design Contradiction:

Ease of manufactureVSLoss of substance

Solution Approach 1:

The patent implements substrate recovery by designing a release layer that allows the substrate to be separated from the package structure after mounting, enabling the substrate to be cleaned and reused for subsequent mounting processes

Inventive Principle:

Principle #34Discarding and recovering

Solution Approach 2:

The patent introduces a release layer as an intermediary between the substrate and the package structure, which facilitates the separation and reuse of the substrate while maintaining the integrity of the mounted components

Inventive Principle:

Principle #24Intermediary (Mediator)

3Illumination intensity

If transparent conductive materials are used, then light transmittance is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvelight transmittanceVSAvoidconductive layer precision

Core Design Contradiction:

Illumination intensityVSManufacturing precision

Solution Approach 1:

The patent changes the material parameter of the conductive layer from conventional opaque metals to transparent conductive materials such as ITO (indium tin oxide), thereby improving light transmittance while maintaining electrical conductivity

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses composite material structures combining transparent conductive materials with the package resin, creating a multi-functional layer that provides both electrical connection and optical transparency

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method simplifies the manufacturing process, reduces costs by enabling substrate reuse, and enhances the efficiency and yield of light-emitting diode packaging while maintaining good conductive properties and transmittance.

Implementation Method 1

In the deposition step, a conductive layer is formed on a side of the patternable material away from the substrate

Methodology Applied

Scientific EffectPhysical Vapour Deposition: Physical Vapour Deposition

Implementation Method 2

In the deposition step, a conductive layer is formed on a side of the patternable material away from the substrate

Methodology Applied

Scientific EffectChemical Vapour Deposition: Chemical Vapour Deposition

Implementation Method 3

A material of the conductive layer includes an indium tin oxide material or a transparent conductive material

Methodology Applied

Scientific EffectElectrical Conduction: Conduction (electrical)

Data Source

PatentUS20240339579A1Light-emitting diode package structure and manufacturing method thereof

Publication Date: 2024.10.10 INGENTEC CORP

AI summary

A manufacturing method of a light-emitting diode package structure includes the steps as follows. A substrate is provided. At least one light-emitting diode and at least one dummy plug are arranged on the substrate in an arranging step. The light-emitting diode and the dummy plug are covered by the patternable material in a coating step. A portion of the light-emitting diode and a portion of the dummy plug are exposed in a patterning step. A conductive layer is in contact with and electrically connected to the light-emitting diode and the dummy plug in a deposition step. A protective layer is formed on the conductive layer in a protective layer forming step. The substrate is separated and a light-emitting diode package structure is formed in a releasing step. A material of the conductive layer includes an indium tin oxide material or a transparent conductive material.