LED Package with Ring-Shaped Rough Surface Carrier

The patent applies curvature by forming a ring-shaped rough surface on the carrier substrate that protrudes into the phosphor layer. This curved/rough surface structure causes the phosphor layer to form a protuberant top portion, replacing the conventional flat or concave surface. The curved interface increases light extraction efficiency by reducing total internal reflection and enhancing light emission in multiple directions, thereby improving luminous efficiency while maintaining manufacturing simplicity through a single molding process.

The patent merges the ring-shaped rough surface structure directly into the carrier substrate during the molding process. Rather than adding a separate component, the rough surface is integrated as an inherent feature of the carrier's top surface. This merging approach creates the light-extraction-enhancing structure without increasing device complexity, as the carrier serves dual functions: mechanical support and optical light management through its integrated rough surface geometry.

The patent applies preliminary action by pre-forming the ring-shaped rough surface structure on the carrier substrate before dispensing the phosphor glue. This pre-configured rough surface acts as a template that guides the phosphor glue to naturally form a protuberant top portion during dispensing. The preliminary structural preparation reduces the precision requirements for the dispensing process itself, as the rough surface geometry inherently directs the material flow and final shape formation, making the process more robust and manufacturable.