Semiconductor LED Package with Roughened Metal Pads
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Solution Overview
Problem
Semiconductor light emitting device packages face reliability issues, particularly in high-current/high-output applications, due to challenges in adhesion between metal connectors and encapsulants, leading to potential delamination and reduced peel strength.
Innovation Solution
A semiconductor light emitting device package is designed with patterned metal pads and bonding pads having surface roughness, which increases the interface area with the encapsulant, enhancing adhesion and reliability by forming a bonding structure with an encapsulant that covers these pads, thereby improving the package's structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If metal pads and bonding pads have smooth surfaces, then manufacturing is easier, but adhesion between metal connectors and encapsulant deteriorates
Solution Approach 1:
The patent applies parameter changes by modifying the surface roughness parameter of metal pads and bonding pads. Specifically, the surface roughness is controlled within ranges of Ra 0.01-0.5 μm and Rz 0.05-2.0 μm to optimize adhesion between metal connectors and encapsulant while maintaining manufacturing feasibility through standardized processes
2Reliability
If surface roughness is increased to improve adhesion, then reliability improves, but manufacturing complexity increases
Solution Approach 1:
The patent resolves this contradiction by defining specific parameter ranges for surface roughness (Ra 0.01-0.5 μm, Rz 0.05-2.0 μm) that can be achieved through conventional semiconductor manufacturing processes, thus improving adhesion without significantly increasing device complexity
Solution Approach 2:
The patent applies preliminary action by forming the patterned surfaces with appropriate roughness on metal pads and bonding pads before encapsulant deposition. This pre-preparation ensures optimal adhesion conditions are established in advance, simplifying subsequent manufacturing steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly increases the adhesion between the metal connectors and the encapsulant, enhancing the peel strength and reliability of the semiconductor light emitting device package, especially under conditions of thermal expansion differences and manufacturing impacts.
Implementation Method 1
each of the first metal pad and the second metal pad having a patterned surface with a surface roughness at least as great as a first surface roughness, a first bonding pad and a second bonding pad disposed on the first metal pad and the second metal pad, respectively, and each having a patterned surface with a surface roughness at least as great as a second surface roughness
Data Source
AI summary
A semiconductor light emitting device package includes a light emitting structure having a first conductive semiconductor layer, an active layer, a second conductive semiconductor layer, a first surface, and a second surface, a first electrode and a second electrode disposed on the second surface of the light emitting structure; an insulating layer, a first metal pad and a second metal pad disposed on the insulating layer, and each having a surface with a first fine uneven pattern so as to have a first surface roughness, a first bonding pad and a second bonding pad disposed on the first metal pad and the second metal pad, respectively, and each having a surface with a second fine uneven pattern so as to have a second surface roughness, and an encapsulant encapsulating the first bonding pad, the second bonding pad, the first metal pad, and the second metal pad.