LED Package With Segmented Light Regions For Uniform Emission
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Solution Overview
Problem
Current LED packages lack efficient designs for multiple light emitting regions with varying colors and light distribution, leading to non-uniform light emission and potential interference between LED chips.
Innovation Solution
The LED package incorporates multiple LED chips of different colors, each mounted on distinct electrode portions with unique openings and phosphor configurations, allowing for parallel arrangement and varying cross-sectional areas to enhance light emission uniformity and suppress interference, with heat dissipating pads for efficient thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple LED chips are mounted in a single package, then light emission efficiency is improved, but light distribution uniformity deteriorates due to interference between chips
Solution Approach 1:
The package is divided into multiple independent light emitting regions, each containing a separate LED chip and phosphor combination. These regions are spatially separated and isolated by structural elements within the package, allowing each region to emit light independently without interference from adjacent chips, thus maintaining uniform light distribution while achieving high overall emission efficiency
Solution Approach 2:
Different LED chips with specific wavelengths and phosphors with specific color temperatures are selectively placed in different light emitting regions. Each region is customized with appropriate LED-chip-phosphor combinations to achieve desired color temperatures (e.g., 1800K-20000K range), creating local quality variations that optimize light emission characteristics for each region while maintaining overall uniformity
2Adaptability or versatility
If LED chips of different colors are used, then color versatility is improved, but light emission uniformity deteriorates
Solution Approach 1:
Different colored LED chips (blue, green, red) are placed in specific light emitting regions and paired with corresponding phosphors to achieve desired color temperatures. Each region is independently optimized for its color characteristics, allowing the package to provide versatile color output while maintaining uniform emission within each color region through proper spatial arrangement and phosphor selection
3Area of stationary object
If multiple LED chips are mounted closely together, then device size is reduced, but heat dissipation efficiency deteriorates
Solution Approach 1:
The package structure divides the mounting area into multiple independent light emitting regions with thermal isolation between them. Each region has its own heat dissipation path through the substrate and packaging materials, allowing compact arrangement of multiple LED chips while maintaining efficient heat dissipation for each chip individually, preventing thermal interference between closely spaced chips
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves uniform and efficient light emission across multiple regions, reducing interference and improving light distribution while allowing for customizable color temperatures and voltage/current applications, enhancing the overall performance and reliability of the LED package.
Implementation Method 1
phosphors filled in the plurality of openings
Implementation Method 2
LED chips... emitting different colors
Implementation Method 3
package mold portion having a plurality of openings formed on one surface thereof so as to radiate light of the plurality of LED chips
Data Source
AI summary
An LED package having a plurality of light emitting regions includes a plurality of LED chips. The LED package further includes a plurality of electrode portions on which each of the plurality of LED chips is mounted, and a package mold portion having a plurality of openings formed on one surface thereof so as to each emit light by the plurality of LED chips.