LED Package Separate Cavities Resin Interface
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Solution Overview
Problem
Conventional LED packages face issues with heat dissipation and light efficiency due to non-uniform resin interfaces and unnecessary phosphor distribution, leading to performance degradation and waste, and require complex heat sink slugs that hinder compactness.
Innovation Solution
The LED package features separate cavities for the LED chip and lead frames, with distinct resin portions to ensure uniform interfaces and efficient heat dissipation, eliminating the need for a heat sink slug by using silicon and epoxy resins and strategically placing phosphor within the first resin portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single large cavity is used for both lead frames and LED chip, then the structure is simple, but the resin interface becomes nonuniform causing light efficiency degradation
Solution Approach 1:
The single large cavity is divided into multiple separate cavities: a first cavity for the LED chip and phosphor, and a second cavity for the lead frames. This segmentation allows each cavity to be filled with resin independently, creating uniform resin interfaces in both regions and eliminating the light efficiency degradation caused by nonuniform interfaces.
2Illumination intensity
If phosphor is broadly distributed in a large cavity, then color conversion is provided, but phosphor is unnecessarily wasted and color deviation occurs
Solution Approach 1:
The phosphor is localized exclusively to the first cavity where the LED chip is positioned, rather than being broadly distributed throughout a large cavity. This local concentration ensures that phosphor particles are positioned where they are most effective for color conversion, reducing unnecessary phosphor waste and minimizing color deviation in different directions.
3Temperature
If a heat sink slug is used for heat dissipation, then thermal management is improved, but the package becomes less compact and more cumbersome
Solution Approach 1:
The heat dissipation function is merged with the existing lead frame structure and supporting member. The lead frames and supporting member are designed to conduct heat away from the LED chip, eliminating the need for a separate heat sink slug and maintaining package compactness while achieving effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances light efficiency, reduces color deviation, prevents phosphor waste, and improves heat dissipation, extending the LED package's lifespan and maintaining performance without the inefficiencies of a heat sink slug.
Implementation Method 1
An LED is an element in which electrons or holes are combined in a P-N semiconductor junction structure by application of current thereby emitting certain light
Implementation Method 2
heat generated from an LED chip has a direct influence on the light emitting performance and life span of the LED package
Data Source
AI summary
The present invention relates a light emitting diode (LED) package. The present invention provides an LED package, wherein one cavity for defining a circumference of an LED chip and other cavities necessary for exposing lead frames are separately formed in a supporting member for supporting lead frames, and the cavity defining the circumference of the LED chip is separately filled with a resin, whereby it is possible to prevent an irregular interface between the resin portions, and when a phosphor is contained in the resin portion formed to be confined in the circumference of the LED chip, it is possible to reduce color deviation for each light directional angle and to prevent unnecessary waste of the phosphor.