Light Emitting Device Package Thickness Reduction
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Solution Overview
Problem
Conventional light emitting diode (LED) package structures are limited in miniaturization due to the thickness of the carrying base, which restricts their ability to meet modern size reduction needs and increases manufacturing costs.
Innovation Solution
A light emitting device design that eliminates the need for a conventional carrying support by using a wavelength conversion layer, light emitting units with exposed electrode pads, and a reflective protecting element that encapsulates the side surface of the light emitting unit, reducing package thickness and manufacturing costs while enhancing forward light emitting efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a conventional carrying base with concave cup shape is used to support the LED chip, then the LED chip is fixed and supported properly, but the package thickness cannot be reduced efficiently
Solution Approach 1:
The patent removes the conventional carrying base with concave cup shape from the package structure. Instead of using a separate supporting base, the LED chip is directly mounted on the reflective protecting element, which serves multiple functions including support, reflection, and protection. This extraction of the carrying base function enables significant reduction in package thickness while maintaining chip support stability through the integrated reflective protecting element structure.
2Ease of manufacture
If a conventional carrying base is used, then the LED chip is properly positioned, but the manufacturing cost increases
Solution Approach 1:
The patent merges multiple functions into the reflective protecting element: it serves as the mounting substrate for the LED chip, provides optical reflection to enhance light extraction, and acts as a protective encapsulation layer. This consolidation of the carrying base, reflective layer, and protection functions into a single component simplifies the manufacturing process, reduces the number of assembly steps, and lowers manufacturing costs while maintaining precise chip positioning through the integrated structure.
3Length of stationary object
If the package structure is miniaturized by removing the carrying base, then the thickness is reduced, but the structural support capability may be compromised
Solution Approach 1:
The reflective protecting element is designed to perform multiple functions simultaneously: it provides mechanical support for the LED chip, acts as a reflective surface to improve light extraction efficiency, offers structural protection to the internal components, and serves as the mounting platform for electrode connections. This multi-functionality allows the package to be miniaturized without compromising structural support capability, as the single element compensates for the removed carrying base through its diverse functional integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for a thinner package structure and increased forward light emitting efficiency without the need for a conventional carrying support, effectively addressing the limitations of traditional LED package designs.
Implementation Method 1
a wavelength conversion layer, at least one light emitting unit and a reflective protecting element. The wavelength conversion layer has an upper surface and a lower surface opposite to each other
Implementation Method 2
The reflective protecting element encapsulates at least a portion of the light emitting unit and a portion of the wavelength conversion layer
Data Source
AI summary
A light emitting device includes a wavelength conversion layer, at least one light emitting unit and a reflective protecting element. The wavelength conversion layer has an upper surface and a lower surface opposite to each other. The light emitting unit has two electrode pads located on the same side of the light emitting unit. The light emitting unit is disposed on the upper surface of the wavelength conversion layer and exposes the two electrode pads. The reflective protecting element encapsulates at least a portion of the light emitting unit and a portion of the wavelength conversion layer, and exposes the two electrode pads of the light emitting unit.