Light-emitting Device Package With Through-Hole Heat Dissipation
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Solution Overview
Problem
Current light-emitting device packages face challenges in effectively dissipating heat, improving reliability, enhancing light extraction efficiency, and maintaining strong bonding and electrical characteristics, while also preventing electrical interference and re-melting of the bonding region during substrate bonding.
Innovation Solution
A light-emitting device package design featuring a body with a through-hole for heat dissipation, metal portions for electrical connection and heat discharge, and a resin for enhanced bonding, along with an inclined inner surface of the through-hole to maximize contact area and block electrical interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional light-emitting device packages are used, then the structure is simple, but heat dissipation is insufficient and reliability is reduced
Solution Approach 1:
The package body is divided into multiple functional regions including a through-hole region for heat dissipation, bonding portions for electrical connection, and metal portions for heat discharge. This segmentation allows each region to perform its specific function optimally, improving overall reliability while managing complexity through functional specialization.
Solution Approach 2:
The through-hole is nested within the package body, and metal portions are nested within the through-hole structure. This nested configuration allows heat dissipation pathways to be integrated within the existing package structure, improving heat dissipation capability without proportionally increasing external complexity.
2Strength
If bonding regions are made larger for stronger bonding, then bonding strength improves, but electrical interference increases
Solution Approach 1:
The harmful electrical interference is extracted and isolated by introducing a resin material between the bonding portions. This resin layer physically separates the bonding regions, maintaining strong bonding strength while blocking electrical interference pathways that would otherwise exist in direct metal-to-metal contact.
Solution Approach 2:
A resin material is introduced as an intermediary substance between the bonding portions. This intermediary layer serves dual purposes: maintaining mechanical bonding strength while providing electrical insulation to prevent interference, thus resolving the contradiction between strength and electrical isolation.
3Temperature
If metal portions extend into the through-hole for better heat dissipation, then heat discharge improves, but electrical connection complexity increases
Solution Approach 1:
The metal portions are designed to perform multiple functions simultaneously: they provide heat dissipation pathways by extending into the through-hole, while also serving as electrical connection elements. This multi-functionality reduces the need for separate components, thereby managing complexity while achieving effective heat discharge.
4Temperature
If the through-hole is enlarged for better heat dissipation, then heat discharge improves, but structural strength is reduced
Solution Approach 1:
The package body is constructed as a composite structure combining the through-hole region for heat dissipation with surrounding material that maintains structural integrity. The composite design allows the through-hole to be sufficiently large for effective heat discharge while the surrounding material provides the necessary structural strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat, improves reliability and bonding strength, enhances light extraction efficiency, and reduces electrical interference, ensuring stable performance and longevity of the light-emitting device package.
Implementation Method 1
first and second metal portions disposed to be spaced apart from each other on a rear surface of the body... effectively discharging heat emitted from the light-emitting device
Data Source
AI summary
A light-emitting device package according to one embodiment comprises: a body including a through-hole formed in an upper surface and a lower surface; a light-emitting device arranged on the upper surface of the body and including first and second bonding units spaced apart from each other; and first and second metal units arranged so as to be spaced apart from each other on the rear surface of the body, wherein a partial area of each of the first and second bonding units overlaps with the through-hole in a vertical direction, the first and second metal units respectively includes first and second extension portions extending to the through-hole; the first and second extension portions is electrically connected to the first and second bonding units, respectively; and the first and second extension portions face each other within the through-hole.