LED Package with Integrated Voltage-Stabilizing Diode
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Solution Overview
Problem
Existing light-emitting diode (LED) packaging methods are complex and unable to effectively reduce the volume of the package structure while providing adequate protection against Electrical Over Stress (EOS) and Electro-Static discharge (ESD) using components like Zener diodes.
Innovation Solution
A light-emitting device design featuring a voltage-stabilizing diode and a light-emitting diode, where a reflective layer and a light-transmitting layer are used, along with a metal connection layer to simplify the manufacturing process and reduce package size, while maintaining protection against EOS and ESD.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a Zener diode is added in parallel with the light-emitting diode to protect against EOS and ESD, then the protection capability is improved, but the manufacturing complexity increases and package volume cannot be reduced
Solution Approach 1:
The patent merges the voltage-stabilizing diode and light-emitting diode into a single integrated light-emitting unit structure. Both diodes share common packaging elements including the reflective layer, light-transmitting layer, and metal connection layer, eliminating the need for separate packaging processes and reducing overall manufacturing complexity while maintaining protection capability
Solution Approach 2:
The patent implements multi-functionality by designing the metal connection layer to simultaneously serve as the electrode structure for both diodes and as the interconnection structure. The reflective layer and light-transmitting layer serve dual purposes of optical management and structural encapsulation for both components, reducing the total number of manufacturing steps
2Reliability
If a Zener diode is added in parallel with the light-emitting diode to protect against EOS and ESD, then the protection capability is improved, but the package volume increases
Solution Approach 1:
The patent applies nesting by placing the voltage-stabilizing diode and light-emitting diode adjacent to each other within a shared package structure. The reflective layer and light-transmitting layer envelop both diodes in a nested configuration, allowing the protection component to be integrated without significantly increasing the overall package volume
Solution Approach 2:
By combining the packaging structures of both diodes into a single unified package with shared layers, the patent achieves compact integration that prevents volume increase despite adding the protection diode
3Reliability
If wire-bonding method is used to electrically connect the light-emitting diode and Zener diode, then the electrical connection is achieved, but the manufacturing process becomes complicated
Solution Approach 1:
The patent merges the electrical connection structure into the common metal connection layer that simultaneously forms electrodes for both diodes. This integrated approach eliminates the need for separate wire-bonding operations, simplifying the manufacturing process while ensuring reliable electrical connections
Solution Approach 2:
The patent extracts the wire-bonding step from the manufacturing process by designing a direct metal-to-metal connection structure where the metal connection layer provides both structural support and electrical interconnection, removing the complex wire-bonding operation entirely
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a compact light-emitting device with enhanced light-emitting efficiency and improved anti-static impact capability, as demonstrated by higher luminous intensity and lower voltage drop ratio during ESD tests.
Implementation Method 1
A reflective layer covers the non-light-emitting element
Implementation Method 2
A light-transmitting layer covers the reflective layer and the light-emitting diode
Data Source
AI summary
The invention discloses a light-emitting device and a manufacturing method thereof. The light-emitting device comprising: a light-emitting unit, the light-emitting unit comprises a non-light-emitting element and a light-emitting diode; a reflective layer covering the non-light-emitting element; a light-transmitting layer covering the reflective layer and the light-emitting diode; a metal connection layer electrically connecting the non-light-emitting element and the light-emitting diode.