Light Emitting Device Package Wire Bonding via Hole Electrode
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional light emitting device packages face issues with incomplete bonding of wires to via hole electrodes due to surface depression, affecting the stability and reliability of the wire bonding process.
Innovation Solution
The light emitting device package incorporates a bonding ball on the stitch formed by the wire, with the via hole electrode positioned non-overlapping to the stitch and bonding ball in a vertical direction, using a multilayer ceramic substrate with a via hole electrode adjacent to the package body edge, and a conductive layer under the frame, ensuring secure electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is performed on via hole electrode surface, then electrical connection is established, but surface depression causes incomplete bonding reducing reliability
Solution Approach 1:
The patent introduces a bonding ball that is formed in advance on the stitch before the wire bonding process. This preliminary structure provides a stable bonding target that compensates for surface depression issues, ensuring complete and reliable bonding even when the via hole electrode surface is uneven or depressed.
Solution Approach 2:
The bonding ball acts as an intermediary element between the wire and the via hole electrode. Instead of directly bonding the wire to the depressed via hole surface, the bonding ball provides an intermediate bonding surface that ensures stable electrical connection, effectively mediating the bonding process between the wire and the problematic via hole electrode surface.
2Length of moving object
If via hole electrode is positioned to overlap stitch, then electrical connection path is shortened, but bonding completeness deteriorates due to surface depression
Solution Approach 1:
The patent shifts the bonding interaction from a two-dimensional surface contact problem to a three-dimensional structure by introducing the bonding ball that protrudes from the stitch. This dimensional change allows the bonding to occur at a different vertical level, avoiding the depressed via hole surface while maintaining electrical connection efficiency.
Data Source
AI summary
Disclosed is a light emitting device package including a package body including at least one electrode pad disposed on a surface thereof, a light emitting device disposed on the package body, the light emitting device being electrically connected to the electrode pad through a wire, and a via hole electrode passing through the package body, wherein the wire forms a stitch on at least one of the light emitting device and the electrode pad, the light emitting device package further includes a bonding ball disposed on the stitch, and the via hole electrode non-overlaps the stitch and the bonding ball in a vertical direction.