Light Emitting Device Package with Recessed Zener Diode
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Solution Overview
Problem
Current light emitting device packages face challenges in improving light extraction efficiency and protecting wires, particularly due to the absorption of light by the Zener diode and interference between semiconductor light emitting devices.
Innovation Solution
The design includes a light emitting device package with a body, first and second reflective cups, a connection pad, and a Zener diode positioned in a recess, where the Zener diode is placed to avoid light absorption, and wires are securely connected to improve electrical reliability and thermal isolation between semiconductor light emitting devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the Zener diode is positioned close to the semiconductor light emitting devices, then electrical protection is improved, but light extraction efficiency deteriorates due to light absorption by the Zener diode
Solution Approach 1:
The Zener diode is positioned in a recess that extends downward from the top surface of the body, placing it in a different vertical dimension below the level of the semiconductor light emitting devices. This spatial separation in the vertical dimension allows the Zener diode to provide electrical protection while avoiding absorption of light emitted by the semiconductor devices, thus resolving the contradiction between electrical protection and light extraction efficiency.
2Quantity of substance
If multiple semiconductor light emitting devices are positioned close together, then device density is improved, but thermal isolation deteriorates causing interference between devices
Solution Approach 1:
The package structure divides the space for semiconductor light emitting devices into separate reflective cups, each containing one device. These cups are spaced apart within the body, providing physical segmentation and thermal isolation between devices. This segmentation allows multiple devices to be housed in a compact package while maintaining adequate thermal separation to prevent interference, thus resolving the contradiction between device density and thermal isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances light extraction efficiency by preventing light absorption by the Zener diode and improves electrical reliability and thermal isolation, reducing interference between light emitting devices and extending the package's lifespan.
Implementation Method 1
a first reflective cup and a second reflective cup positioned in a top surface of the body spaced from each other
Implementation Method 2
a Zener diode disposed in the recess
Data Source
AI summary
A light emitting device package includes a body, a first reflective cup and a second reflective cup disposed in a top surface of the body spaced from each other, a connection pad disposed in the top surface of the body spaced apart from the first reflective cup and the second reflective cup, a recess formed in the top surface of the body spaced apart from the first reflective cup, the second reflective cup, and the connection pad, a first semiconductor light emitting device disposed in the first reflective cup, a second semiconductor light emitting device disposed in the second reflective cup, and a Zener diode disposed in the recess, wherein the first reflective cup and the second reflective cup are recessed from the top surface of the body.